Compared with the traditional PCB or FPC, the production process of rigid-flex board is more complex, and the requirements for operation specifications are more stringent, so it is of vital significance to deeply understand and strictly implement the operation specifications of rigid-flex boards to ensure product quality, improve production efficiency and reduce manufacturing costs.
Continued from the second article, continue to write the fourth specification of PCB rigid-flex board.
PCB rigid-flex board operation specification (1) PCB rigid-flex board operation specification (2) PCB rigid-software board operation specification (3).
Three.
Ten. 3. Silk screen text.
Process flow
Drying the net, checking the frame, setting the net, adjusting the ink, silk screen curing.
Defective items
Character printing bias Ghost oil Missing characters The model or cycle is wrong.
Job control
A. Silk screen printing according to the relative model screen used in MI instructions.
b. Clean the debris on the table before operation to prevent crushing.
c. Control the phenomenon of less printing, more printing, pad and blurring of text.
d. When cleaning the rework board, the desktop must be clean.
XXXIV. 34 |Gong edge
Process flow
Open the auxiliary materials, hit the pins, put the upper board, adjust the program, adjust the parameters, the gong edge, remove the board, and convert the sequence.
Defective items
Burr crimped, offset.
Job control
a. Check whether the data is consistent with the plate type data.
b. To adjust the parameters, you need to do the first board, check the appearance, burrs, crimps, and test the size.
XXXV. 35 |Inspection
Process flow
Check the appearance of the mark statistics and hit scrap.
Defective items
Critical defects: open circuit, short circuit, leakage gold cover pad.
General defects: gold surface oxidation, burrs, blurred text, scratches, different colors, foreign bodies, chips, etc.
Job control
a. Clean and inspect the debris on the countertop to prevent scratches.
b. Carry out quality inspection according to customer standards.
The complete manufacturing process of the entire PCB rigid-flex board from cutting to final inspection, including drilling, cleaning, dry film pressing, development, etching and decoating, film pressing, secondary drilling, grinding, plasma treatment, copper plating, solder mask ink printing, circuit graphics, developing etching, gold layer deposition, electrical performance testing, text silk screen printing, board edge cutting and final quality inspection, etching and other processes of the operation specifications have been introduced.
The process describes in detail the complete manufacturing process of PCB rigid-flex board from final inspection, including drilling, dry film pressing, developing, etching and decoating, film pressing, secondary drilling, grinding plates, plasma treatment, copper immersion copper plating, solder mask ink printing, circuit graphics development etching, gold layer deposition, electrical performance testing, text silk screen printing, board edge cutting and the deepest copper plating, solder mask ink printing, circuit graphics development etching, gold layer deposition, electrical performance testing, text silk screen printing, Cutting of the edge of the board and the final quality inspection ensure the precision of the rigid-flex board.