With the continuous emergence of cloud computing, artificial intelligence, and autonomous driving applications, higher requirements are put forward for high-performance computing. The mainstream CMOS process is close to the theoretical limit, the cost of advanced node process remains high, and the increase in the computing power of CPU and GPU chips has to rely on the increase of power, and the resulting heat generation has increased exponentially. This has led to an increasing emphasis on the associated advanced package thermal solutions. The use of indium or indium-based alloys as welded, pressed, thermal interface materials is considered one of the most effective solutions. This year, Indium Corporation participated in the 4th Thermal Management Materials and Technology Conference and 2023 International Thermal Management Materials Technology Expo held in Shenzhen and the 11th Thermal Conductivity and Heat Dissipation Materials and Equipment Exhibition 2023 held in Shanghai. Let's take a look at Indium's thermal management products. STIM welded thermal interface material
Applications: HIA, Advanced Packaging
Pure indium or indium-based alloy solder lugs, pre-coated flux solder lugs, providing a total soldering solution with low voiding, high thermal conductivity and high reliability for CPUs and GPUs.
Liquid metal. High thermal conductivity
Improve product longevity and reliability.
Rapid heat dissipation
Low interface impedance ensures fast heat dissipation.
Wettability
Excellent wetting of metallic and non-metallic surfaces.
Multiple forms
Liquid metal TIMS is available in a variety of alloy combinations, including gallium-indium and gallium-indium-tin alloys
heat-spring®
Many applications require thermal interface materials to be placed on the chip lid or to be in direct contact with heat sources and coolants. In response to this need, we have developed a metal thermal interface material, Heat-Spring, a compressible material solution with a pressure range of 35 psi to 100+ psi.
SMA-TIM (soft metal alloy) made from pure indium provides uniform, low interfacial thermal resistance, even at lower pressures. The patented heat-spring surface treatment technology further reduces the interfacial thermal resistance.
Pure indium has a long service life as a thermal interface material, and because SMA-TIM products are made of metal, there will be no cracking or extrusion problems during long power cycles. gallitherm gallium-based liquid metal.
With more than 60 years of experience manufacturing gallium-based liquid metals, Indium Corporation has introduced gallitherm gallium-based liquid metal solutions. The emergence of the program,It solves the problem of liquid metal application in thermal interface materials, and successfully achieves mass shipment in North America and Asia-Pacific!
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