On December 8, Dr. Min Yao, R&D Project Manager of Indium Sintering Materials, attended the Electronic Packaging Technology Conference (EPTC) held in Singapore and gave a report on "Pressurized Copper Sintering Materials for Power Module Chip Placement Applications", which was highly praised by the guests and audiences. 
Singapore Electronic Packaging Conference.
"Since the introduction of RoHS regulations, there have been higher requirements for the performance of high-temperature lead-free die attach materials, and researchers and industry have been developing new materials with the same performance as high-lead solders," said Dr. Yao Min. "It is also widely used in advanced packaging, LED, electric vehicles and other fields.
Singapore Electronic Packaging Conference – Dr. Yao Min in his speech.
Speaker
Yao Min
He joined Indium Corporation in 2015 and is currently the R&D project manager of indium corporation sintering materials, graduated from Central China Normal University in Wuhan. She was a member of the U.S.-China Exchange Ph.D. Program and spent her Ph.D. at the University of Kentucky, where she led the development of pressurized, non-pressurized copper sintering materials. In 2017, it won the IMPACT "Best ** Award".
She drives the development and iteration of advanced sintered materials through opportunities to collaborate with customers. We also work closely with the sales team and customers to review the feedback of all parties to optimize the new materials.
After the event, the organizers also presented Indium with a "Silver Sponsor" medal in recognition of Indium Corporation's outstanding contributions to the industry.
Indium Corporation has a number of innovative high-temperature lead-free solutions, including new high-temperature lead-free solder pastes, pressurized & pressureless silver sintering, copper sintering materials, and more. For example, the high-strength, high-thermal, high-conductivity and high-reliability pressurized copper sintering materials introduced by Dr. Yao at the meeting are not only suitable for gold, silver and copper metal interfaces, but also suitable for the chip mounting process of third-generation semiconductors. If you are interested in the following products, you are welcome to contact us through the following quick private message, and we will send you detailed product information. Related products: Inforce 29
Inforce 29 is a pressurized copper sintering paste for high reliability, high thermal conductivity, die attach applications with high processability for printing or dispensing applications. Provides excellent sintering properties on bare copper surfaces without the need for expensive gold or silver plating.
durafuseht
DuraFUSE HT is a high-temperature lead-free solder paste developed based on new alloy technology, with a melting point of 280°C, thermal conductivity and electrical conductivity are better than that of high-lead solder, and has passed TCT (-55 175°C) 1000 cycles and TCT (-65 150°C) 3000 cycles test, DURAFUSE HT does not need to make any changes to the existing process, and is a direct alternative to the existing high-lead solder.