Introduction: In the semiconductor industry, accurate measurement of the thickness distribution of wafers is essential to ensure product quality. In this article, we will introduce an example of a high-precision through-beam laser displacement meter for wafer thickness distribution measurement.
1.Introduction.
With the continuous development of science and technology, the demand of the semiconductor industry is getting higher and higher. As one of the core materials of semiconductor processing, accurate measurement of the thickness distribution of wafers during the production process is essential to ensure the performance and quality of products.
2.Problems and challenges.
The wafer surface is smooth and flat, and it is difficult for traditional laser displacement sensors to accurately capture surface position information, which cannot meet the needs of high-precision measurement. Therefore, we need a more accurate measurement method to solve this problem.
3.Solution.
In order to achieve high-precision measurement of wafer thickness distribution, we use a high-precision through-beam laser displacement meter. The displacement meter uses the coaxial optical principle of spectral confocal to capture the thickness of multiple points of the wafer by moving it on the XY stage multiple times, so as to accurately measure its thickness distribution.
4.Implementation process.
4.1 Preparation: Before making a measurement, you first need to prepare a high-precision through-beam laser displacement meter and wafer sample. At the same time, make sure that the calibration and calibration of all equipment has been completed.
4.2 Multi-point measurement: The wafer sample is placed on the XY stage, and the stage is moved in different directions through the control system, so that the laser displacement meter can capture the thickness information of the wafer at different positions.
4.3. Data processing: The data obtained by the laser displacement meter, combined with the pre-established calibration model, we can obtain the thickness value of the wafer at different positions. Further use of data processing software can be used to create a thickness distribution map of the wafer.
5.Results & Analysis.
With the above measurement methods, we have successfully achieved the measurement of the thickness distribution of the wafer. With the high-precision through-beam laser displacement meter, we can achieve a measurement accuracy of about 100nm, which meets the demand for high-precision measurement in the semiconductor industry.
6.Application value and prospects.
Accurate measurement of wafer thickness distribution is of great value in the semiconductor industry. By utilizing high-precision through-beam laser displacement meters, we can effectively improve the quality and performance of our products and further improve the production process. In the future, we can further research and improve the performance of high-precision through-beam laser displacement meters to meet the increasing measurement needs. At the same time, combined with artificial intelligence and big data analysis and other technologies, wafer thickness distribution measurement and process optimization are combined to achieve a more refined and intelligent semiconductor processing process.
Conclusion: It is a feasible and effective method to measure the thickness distribution of wafers by using high-precision through-beam laser displacement meter. By capturing wafer thickness at multiple points, rather than measuring fixed-point thickness, the thickness distribution of wafers can be accurately measured and provide the semiconductor industry with high-quality products and the basis for improving production processes.