IT Home reported on December 19 that TSMC is actively promoting the 2nm process node, and the first machine is planned to enter the factory in April 2024Recently, there was news that TSMC 1The 4nm wafer fab will be located in the second phase of the Taichung Science Park.
According to the report, TSMC is currently actively expanding COWOS packaging capacityIt is planned to build a 7th advanced assembly and test plant in the Taichung areaChiayi Science Park and Yunlin are currently being evaluated.
On the 14th of this month, TSMC revealed at a panel discussion at the IEEE International Electronic Devices Conference (IEDM) held recently that its 1The research and development of the 4nm-scale process is in full swing.
According to the slides given by Dylan Patel of SemiAnalysis, TSMC's 1The 4nm process node is officially known as A14.
At present, TSMC has not disclosed the mass production time and specific parameters of the A14, but considering that the N2 node is scheduled to be mass-produced by the end of 2025 and the N2P node is scheduled to be mass-produced by the end of 2026, the A14 node is expected to come out in 2027-2028.
In terms of technology, the A14 node is unlikely to feature vertically stacked complementary field-effect transistor (CFET) technology, although TSMC is still exploring this technology. As a result, the A14 will likely rely on TSMC's second- or third-generation surround gate field-effect transistor (GAAFET) technology, just like the N2 node.
Semiconductor industry insiders believe that TSMC is currently feeling the pressure from Samsung and Intel, and founder Zhang Zhongmou has shifted his main concerns from Samsung to Intel.
Intel recently reported success with PowerVia backside power technology, glass substrates, and Foveros Direct for advanced packaging.
According to TrendForce's 3Q23 Top 10 Global Foundry Revenue Rankings, Intel's foundry business entered the global top 10 for the first time, ranking ninth with the industry's fastest quarterly growth.