I. Introduction.
With the continuous development of science and technology, semiconductor refrigeration technology, as a new type of refrigeration technology, has been widely used in many fields. However, semiconductor cooling sheets will emit a lot of heat during use, and if the heat is not dissipated in time, it will have a negative impact on the cooling effect and service life. Therefore, how to effectively dissipate heat has become a key issue in the application of semiconductor cooling sheets. In this article, we will focus on the principle of heat dissipation of semiconductor cooling sheets, the heat dissipation mode and the optimization of heat dissipation performance.
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Second, the principle of heat dissipation of semiconductor cooling sheets.
Semiconductor refrigeration sheets are cooled using the Seebeck effect. When a circuit composed of two different materials is connected at two different temperature points, the electrons flow from the high temperature end to the low temperature end due to the different concentrations of free electrons in the material, resulting in a voltage difference between the two ends. This voltage difference drives the current from the low temperature end to the high temperature end, taking away the heat and achieving the cooling effect. However, during the refrigeration process, semiconductor cooling sheets generate a lot of heat, which will affect the cooling effect and service life if the heat is not properly controlled.
3. Semiconductor cooling sheet heat dissipation method.
1.Natural heat dissipation: Natural heat dissipation refers to the use of air convection to transfer heat to the surrounding air. This method is suitable for less powerful semiconductor coolers. However, when the power is high, the natural heat dissipation effect is poor, and other heat dissipation methods are required.
2.Forced heat dissipation: Forced heat dissipation refers to the use of forced convection devices such as fans to transfer heat to the surrounding air. This method is suitable for high-power semiconductor chillers. Forced heat dissipation can significantly improve heat dissipation efficiency, but it requires additional energy consumption.
3.Heat pipe heat dissipation: A heat pipe is a highly efficient heat transfer element that uses the phase change process of liquid evaporation and condensation to transfer heat from one end to the other. Heat pipe heat dissipation is suitable for high-power semiconductor cooling sheets, which has the advantages of high heat transfer efficiency, energy saving and environmental protection.
Fourth, the heat dissipation performance of semiconductor cooling sheet is optimized.
1.Optimize thermal design: In the design stage of semiconductor cooling sheets, the heat dissipation requirements should be fully considered, and the parameters such as material, structure, and size should be reasonably selected. For example, heat sinks can be made of materials with high thermal conductivity and low coefficient of thermal expansionReasonable structural layout and size design are adopted to improve heat dissipation efficiency.
2.Enhanced heat dissipation surface treatment: Improve the heat conduction performance and corrosion resistance of the heat dissipation surface through surface treatment technology, such as spraying thermal conductive coatings, adding heat dissipation fins, etc. These measures can significantly improve heat dissipation efficiency and extend the service life of semiconductor cooling pads.
3.Adopt advanced heat dissipation technology: With the continuous development of science and technology, new heat dissipation technologies are constantly emerging. For example, heat pipe technology is used to transfer heat from a semiconductor chiller to a heat source away from the deviceLiquid cooling technology is used to transfer heat through liquid circulation to an external cooling system, etc. These new cooling technologies can improve heat dissipation efficiency and reduce energy consumption and costs.
V. Conclusions. As a new type of refrigeration technology, semiconductor refrigeration sheets have been widely used in many fields. However, how to effectively dissipate heat has become a key issue in the application of semiconductor refrigeration sheets. In this paper, the principle of heat dissipation, heat dissipation mode and heat dissipation performance optimization of semiconductor cooling foil are carried out. By optimizing the thermal design, strengthening the surface treatment of heat dissipation, and adopting advanced heat dissipation technology, the heat dissipation performance and service life of semiconductor cooling sheets can be significantly improved. With the continuous development of science and technology, it is believed that more efficient and environmentally friendly heat dissipation technologies will be applied to the field of semiconductor refrigeration chips in the future.