Pure nickel and nickel alloy are commonly used metal materials in industry, which have the advantages of fatigue resistance, oxidation resistance, high temperature resistance and corrosion resistance, and are widely used in aviation, aerospace, petrochemical industry and electronics. However, with the development of science and technology, the surface roughness of pure nickel and nickel alloys in microelectronic devices, optical precision molds and other products is required to reach the sub-nanometer level, and surface defects such as scratches need to be avoided. In order to solve this problem, chemical mechanical polishing (CMP) technology is used to perform ultra-precision machining of metal surfaces. Pure nickel alloy manufacturers
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In CMP technology, traditional metal CMP mostly uses highly corrosive and toxic chemical reagents such as nitric acid and hydrofluoric acid, which are extremely harmful to the environment and operators. Therefore, in this paper, nickel alloy C2000 and pure nickel N4 are taken as research objects, and ultra-smooth and low-damage processing of metal surfaces is achieved by preparing environmentally friendly polishing slurries. The environmentally friendly polishing slurry developed contains hydrogen peroxide and silica sol, and the pH value is adjusted by a mixed solution of malic acid, sodium hydroxide and deionized water, which effectively avoids the harm to the environment and operators. The process parameters were optimized through experiments, the material removal rate was improved, and finally the ultra-smooth and low-damage nickel alloy surface was prepared.
In the evaluation range of 50 70 m 2, the optimal surface roughness Ra value can be measured to 0440 nm, which is lower than the existing nickel alloy polishing results. In order to study the CMP mechanism of nickel alloys, X-ray photoelectron spectroscopy (XPS), electrochemistry, infrared spectroscopy and other techniques were used to study the chemical effects of polishing slurry composition, and a mechanism model of the polishing process of nickel alloys was proposed. In the CMP process, the synergistic effect of surface oxidation, oxide decomposition, formation of complexes and mechanical removal of the surface reactive layer by abrasive particles is experienced. Among them, hydrogen peroxide mainly plays an oxidizing role, malic acid dissolves the oxide film through ionized hydrogen ions to produce nickel ions, and then partially protonated or deprotonated malic acid will coordinate with nickel ions to form complexes, effectively improving the material removal rate and surface quality.
On the basis of nickel alloy CMP, the two-step polishing process is also used to process pure nickel, and the applicability of nickel alloy polishing slurry is compared experimentally, the optimized polishing slurry contains hydrogen peroxide and nano alumina, and the pH value is adjusted by using the same mixed solution such as malic acid, and finally 0869 nm surface roughness with no obvious defects on the surface. Based on the mechanism analysis of nickel alloy CMP, the surface chemical effect of polishing slurry composition on pure nickel was analyzed by XPS, and the processing mechanism of pure nickel CMP was summarized.
In ultra-precision machining technology, mechanical polishing and chemical polishing are one of the commonly used methods. However, the processed surface quality of these technologies is low and prone to environmental pollution. Therefore, chemical mechanical polishing (CMP) technology is used to process metal surfaces. Traditional metal CMP mostly uses highly corrosive and toxic chemical reagents, which are extremely harmful to the environment and operators. Therefore, in this paper, nickel alloy C2000 and pure nickel N4 are taken as research objects, and ultra-smooth and low-damage processing of metal surfaces is achieved by preparing environmentally friendly polishing slurries.
Based on the material properties of nickel alloy C2000, a two-step polishing process of mechanical and chemical machinery is proposed. In the mechanical polishing process, an abrasive polishing wheel is used to rough polish the materialIn the chemical mechanical polishing process, the developed environmentally friendly polishing slurry is used for fine polishing. The environmentally friendly polishing slurry contains hydrogen peroxide and silica sol, and the pH value is adjusted by a mixed solution of malic acid, sodium hydroxide and deionized water. The process parameters were optimized through experiments, the material removal rate was improved, and finally the ultra-smooth and low-damage nickel alloy surface was prepared. In the evaluation range of 50 70 m 2, the optimal surface roughness Ra value can be measured to 0440 nm。
In order to study the CMP mechanism of nickel alloys, X-ray photoelectron spectroscopy (XPS), electrochemistry, infrared spectroscopy and other techniques were used to study the chemical effects of polishing slurry composition. In the CMP process, the synergistic effect of surface oxidation, oxide decomposition, formation of complexes and mechanical removal of the surface reactive layer by abrasive particles is experienced. Among them, hydrogen peroxide mainly plays an oxidizing role, malic acid dissolves the oxide film through ionized hydrogen ions to produce nickel ions, and then partially protonated or deprotonated malic acid will coordinate with nickel ions to form complexes, effectively improving the material removal rate and surface quality.
On the basis of the nickel alloy CMP, pure nickel is also processed using a two-step polishing process. The suitability of the nickel alloy polishing slurry was compared, and the optimized polishing slurry contained hydrogen peroxide and nano alumina, and the pH value was adjusted using the same mixed solution such as malic acid. Eventually got 0869 nm surface roughness with no obvious defects on the surface. Based on the mechanism analysis of nickel alloy CMP, the surface chemical effect of polishing slurry composition on pure nickel was analyzed by XPS, and the processing mechanism of pure nickel CMP was summarized.