Under the conditions of welding, transportation, and use, electronic components are usually deformed due to vibration, impact, bending, etc., resulting in mechanical stress on the solder joints or devices, and eventually lead to the failure of the solder joints or devices. The push-pull test can be used to simulate the mechanical failure model of solder joints, analyze the failure causes of solder joints or devices, and evaluate the reliability of materials and parts.
Thrust test applications.
Thrust testing in the current mainstream market is mainly to verify the following three points:
1) Evaluate the reliability of solder joints of SMD materials;
Test method: AB glue and 502 are fixed to the PCB board to keep the thrust direction parallel to the surface of the sample.
2) Evaluate the reliability of the solder joint between the IC and the PCB;
The customer specifies the test altitude of 3000 m, the test speed is in accordance with the JESD22-B117A standard, the low-speed thrust test speed should be between 100 - 800 m s, and 100 m s is selected for thrust test. Observe the condition of the solder joints at the bottom of the material after the test, and analyze the reliability of the solder joints of the material and parts with the thrust value and curve obtained from the test.
Test purpose: Because the shell of the body falls off after the application of the actual plate, the mechanical failure model is tested with push-pull force. The firmness of the solder joint is tested by the thrust value and phenomenon after the test.
Thrust test. 3) Evaluate the reliability of the solder joints of BGA packaging materials;
During the thrust test, the direction of the thrust is parallel to the flat surface of the object to be measuredAfter the thrust test, the thrust value should also be combined with a magnifying glass to observe the actual welding situation to evaluate the reliability of the solder joint. Theoretically, there should be more samples to be measured, and the larger the thrust value, the better.
Tensile test applications.
In the current mainstream market, the tensile test is mainly to verify the following:
a) Evaluate the reliability of the welded joints of the gold wire;
The position of the crochet test is generally the 2nd pull test at the tail of the wire bond, the highest point of the 1st pull test, and the tensile test can also be carried out at the specified position according to the customer's requirements. There is a difference in location, but also in intensity. The test requires the determination of the tensile force and wire break mode, and the analysis is carried out according to the lower specification value of the sample to be measured. Breakpoints can also be observed with a magnifying glass.
Tensile test. Laboratory push-pull test and capability.
Automatic push-pull machine test.
Thrust range: 0 20kg
Tensile range: 0 100g System accuracy: 025% FS Note: 025% FS is the accuracy is the full amount.
The push-pull force test is an indispensable dynamic mechanics to measure the fixed strength and bonding ability of the deviceIts values are efficient and precise, and the strength of the material can be detected intuitively by means of constant speed movement.
There are several reasons why electronic devices should be tested for push-pull force:
Verify the reliability of solder joints of SMD materials.
Verify the reliability of the solder joint between the IC and the PCB.
Evaluate the reliability and durability of electronic component connections.
Simulate the mechanical failure model of solder joints, analyze the failure causes of solder joints or devices, and evaluate the reliability of materials and parts.