The STM32WB55Rev6 multiprotocol wireless and ultra-low power device embeds a powerful ultra-low power radio module (compliant with Bluetooth Low Energy Sig specification 5.)0 and IEEE 80215.4-2011 standard). The device includes a dedicated ARM Cortex-M0+ to perform all low-level real-time operations.
The STM32WB55Rev6 is based on the high-performance ARM Cortex-M4 32-bit RISC core (operating up to 64 MHz) and is designed for ultra-low power consumption. The core comes with a single-precision floating-point unit (FPU) that supports all ARM single-precision data processing instructions and data types. It also features a DSP instruction set and a memory protection unit (MPU) for enhanced application security.
IPCC provides enhanced inter-processor communication with six bidirectional channels. HSEM provides hardware semaphores for sharing common resources between two processors.
The STM32WB55Rev6 is embedded with high-speed memory (up to 1 MB Flash memory for STM32WB55xx, up to 512 KB for STM32WB35xx, up to 256 KB SRAM for STM32WB55xx, 96 KB for STM32WB35xx), a Quad-SPI Flash memory interface (available in all packages), and a wide range of enhanced IOs and peripherals.
Direct data transfer between memory and peripherals (as well as memory-to-memory) is supported by 14 DMA channels, with fully flexible channel mapping outside DMAMUX.
These devices offer a variety of mechanisms for embedded flash memory and SRAM: readout protection, write protection, and proprietary** readout protection. The memory part can only be accessed exclusively by cortex -m0+ to ensure security.
Type: Transmit Receive + MCU
RF Series Standard: 80215.4. Bluetooth.
Protocol: Bluetooth v50、thread、zigbee®
Modulation: GFSK
Frequency: 2402ghz～2.48ghz
Data rate (maximum): 2mbps
Power output: 6 dB.
Sensitivity: -100dBm
Memory size: 512KB Flash, 256KB SRAM
Serial interfaces: IC, SPI, UART, USART, USB
Universal I/O interfaces: 49
Voltage - Power Supply: 171v～3.6v
Current - Receiving: 45ma～7.9ma
Current-emission: 52ma～12.7ma
Operating temperature: -40 105 (ta).
Mounting Type: Surface Mount.
Box: 68-VFQFN Exposed Pad.
*Commercial device package: 68-VFQFPN (8x8).
Radio broadcasting.
2.4 GHz.
Bluetooth 5-capable RF transceivers.
ieee 802.15.4-2011 PHY Specification.
and Mac, support threads and.
zigbee®3.0
RX sensitivity: -96 dBm (Bluetooth Low.)
energy at 1mbps), -100 dBm (802.)15.4)
Programmable output power up to +6 dBm
The step size is 1db
Integrated baluns to reduce BOM
Supports 2 Mbps
Dedicated ARM 32-bit Cortex M0+ CPU
Used at the real-time radio layer.
Precise RSSI for power control.
For systems that require compliance.
Complies with radio frequency regulations etsi en
300 328, EN 300 440, FCC CFR47 Part 15.
and ARIB STD-T66
External PA is supported
Integrated Passive Devices (IPDs) are available
Companion chip for optimal matching.
solution (MLPF-WB55-01E3 or.)
mlpf-wb55-02e3)
Ultra-low-power platform.
1.71 to 36 V power supply.
40°C to 85 105°C temperature range.
13 na off mode.
600 Na standby mode + RTC + 32 kb
Memory. –2.1 A stop mode + RTC + 256 kB RAM
Active mode MCU: 53 A MHz < on RF
and smps on.
Radio: RX 45 ma/tx，0 dbm 5.2 ma
STM32WB55Rev6 schematic.
STM32WB55Rev6 pin diagram.
STM32WB55Rev6 package.
STM32WB55Rev6 silk screen.
STM32WB55Rev6 part number explained.
If you need data sheets, sample testing, procurement, BOM matching and other needs, **Customer Service WeChat: 13310830171.