Huawei unveils new patent for semiconductor manufacturing, revealing the progress of Kirin dual core

Mondo Technology Updated on 2024-01-30

Huawei unveils new patent for semiconductor manufacturing, revealing the progress of Kirin dual-core stacking

With Kirin, plus 5G, everything is easy to say!

Judging from the patent published by Huawei, this patent was registered in September 2020, indicating that the reliability of this technology should have been obtained two years ago.

With the ban on advanced chip production technology, Huawei and China's chip manufacturers can only make their own decisions in this war.

Some time ago, Huawei announced an invention patent for "semiconductor packaging". The technology of the present invention can not only reduce the production cost, but also improve the efficiency and reliability for the production of semiconductor packaging.

This also means that Huawei's core technology has made some progress in the production of chips.

Do you remember?On November 26, 2020, Huawei announced a patent for chip packaging technology, which Huawei uses to enhance the cooling effect of the chip, thereby further enhancing the overall performance of the chip.

You see, these two patents both illustrate one thing, that is, Kirin's ** has declined, the cooling has been solved, the yield has been improved, and the overall strength of the entire processor has been greatly improved.

I hope you will understand me, and in half a year, you will tell me that you are right.

As we all know, Huawei's dual-core overlap can effectively avoid advanced lithography machines, which has also been done on Apple's M1Ultra, but because the two M1Max processors are too large, they are only suitable for PCs, Huawei's two processors can allow the two processors to occupy an advantage in size, so that they can be better embedded in mobile devices.

However, the shortcomings of the dual-core architecture are obvious, such as temperature control, cost control, yield, etc., and the two technologies announced by Huawei have given an effective solution.

Therefore, Huawei's two patents on chip production are for the "dual-core reactor", that is to say, the news that Huawei is about to break through the bottleneck, in a sense, also proves the progress of Huawei's Kirin processor research and development to a certain extent, now, we just need to wait for Huawei's return, Huawei, and China's semiconductor industry, work together!

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