(Report produced by Author: Caitong**, Zhang Yimin).
1.1. Semiconductor optical enterprises: based on traditional business, deeply bound to leading equipment companies
The semiconductor optics industry came into being with the development of the integrated circuit industry, which is closely related to lithography and quantity detection equipment. In the early days, the production scale of chips was small, and the wirewidth of integrated circuits was rough; The use of lithography and quantity detection equipment is relatively limited, and the technical design is relatively simple, so the demand for semiconductor optical components is small. At this time, semiconductor optics has not yet formed an independent industrial chain.
With the continuous development of the semiconductor industry, the line width of integrated circuits is shrinking; Shipments of optical equipment such as lithography and volume inspection are growing rapidly, and designs are becoming more complex and sophisticated. The market size of semiconductor optical components for optical equipment has expanded rapidly, and the production threshold has been greatly improved, and a separate semiconductor optical industry chain has gradually been formed, the main products include: light sources, industrial camera sensors, precision optical processing components, optical components, other optical components, optical software, etc. Advances in optical component design and ultra-precision machining technology require long-term experience. In the early 18th century, the optical industry was mainly distributed in France and England; In the second industrial revolution, the German optical industry, with Jena as the cradle, came from behind and gave birth to the modern optical industry. After World War II, Japan's civilian optical industry gradually developed, and established Japan's position in the semiconductor optics industry. At the same time, the United States, with its technological and economic advantages, also gathered a number of leading optical enterprises. Therefore, the world's leading semiconductor optical companies are divided into three clusters: the United States, Europe, and Japan.
Major overseas manufacturers of high-end optical glass raw materials include Corning in the United States, SCHOTT in Germany, Ohara in Japan, etc. Overseas manufacturers of semiconductor optical light sources are Coherent in the United States, Cymer in the United States, Newport in the United States, Trumpf in Germany, Toptica in Germany, **antes in the Netherlands, Gigaphoton in Japan, Hamamatsu in Japan, and Oxide in Japan. Overseas manufacturers of optical equipment motion platforms include Aerotech in the United States, Newport in the United States, PI in Germany, etc. The main manufacturers of cameras (sensors) for the semiconductor industry are **antes in the Netherlands and Hamamatsu in Japan. In terms of optical components, EDMUND, Materion, and Thorlabs from the United States, Zeiss and Leica from Germany, Nikon, Canon, and Olympus from Japan have all participated.
According to SEMI statistics, in 2021, optical components accounted for 167%, with a market size of $8.2 billion. Fuchuang Precision estimates that the raw material cost of optical components accounts for about 55% of optical semiconductor equipment such as lithography equipment. In 2023, ASML will have a revenue of 27.6 billion euros, ranking first in the world for the first time. Another major optical manufacturer, KLA, is expected to have a revenue of $9.6 billion, which can be estimated from the revenue of the above companies to estimate the semiconductor optical components market in 2023. Germany's Carl Zeiss (Zeiss) is the main supplier of ASML in the Netherlands, with a revenue of 35With 5.5 billion euros, it is the world's largest supplier of semiconductor components.
2.1 Optical component parameters determine the performance of semiconductor optical devices
Semiconductor optical equipment, represented by lithography machine and brightfield detection equipment, is the most accurate equipment in the integrated circuit production line. Typical etching and thin film deposition equipment usually uses chemical gases or liquids as reaction raw materials, and the reaction (production) process is fine-tuned through the principles of mechanics, electromagnetics, thermodynamics, fluidics, etc., and sometimes with the help of measuring instruments such as spectrometers to monitor the process conditions. However, due to the physical properties of gases and liquids, the vast majority of etching or thin film deposition equipment has limited accuracy when working alone. In contrast, optical devices that use short-wavelength light sources have extremely high accuracy. The complete physical quantities of any photoelectric field include frequency, amplitude, phase, and polarization state. Taking optical quantity inspection as an example, wafer defect detection is generally carried out in the most advanced optical system, and the frequency usually does not change; However, due to the wave-particle duality of light, its amplitude, phase, and polarization state will all change.
Different from the optical principle of direct imaging when the lithography machine is working, the optical quantity detection equipment widely adopts the principle of indirect imaging. The quantity detection equipment is composed of a plurality of incident channels (different wavelengths, incident angles, illumination modes, etc.) and a plurality of signal collection channels (scattered light, diffracted light, reflected light, etc., width and narrowness, etc.), which are combined into different working modes. By monitoring spectral information in different modes and then using algorithms to reverse image the wafer surface, defects or measurement parameters on the wafer surface can be found. The indirect imaging method is less constrained by the diffraction limit of the wavelength of the lightHowever, there are extremely high requirements for the detection band, beam polarization state, illumination beam cross-sectional shape, objective lens NA value, detector sensitivity, etc. In the process of quantity testing in advanced processes, the increase in the number of parameters to be measured brings additional challenges. The overlay error measurement component built into the lithography machine encountered similar problems in the continuous improvement of accuracy. The development of the semiconductor optics industry and the above challenges have put forward higher requirements for optical components such as light sources, camera sensors, motion platforms, and algorithms.
2.2 Lasers: The source of power for optical devices
Light sources (semiconductor lasers) provide the lasers needed for the operation of lithography and measurement inspection equipment, and are also used in the fields of wafer cutting, debonding, and marking. The light source is mainly composed of a pump source, a gain medium, a resonator, etc. The pump source is the excitation source of the laser, and the resonator is the loop between the pump light source and the gain medium, and the gain medium refers to the working substance that can amplify the light. In the working state, the gain medium absorbs the energy provided by the pump source, and outputs a specific type of laser through the resonator oscillation mode selection.
The light sources used in lithography machines include a mercury light source with a wavelength of 436 365 nm, a deep ultraviolet excimer light source with a wavelength of 248 193 nm (KR gas and fluorine gas combine and decompose in a high-pressure and strong electric field environment to release photons), and 13Extreme ultraviolet light source with a wavelength of 5nm (CO2 laser bombarded tin droplets twice to produce 135nm wavelength optical line). The key technical parameters of the light source include pulse frequency, duration, single pulse energy and its stability, output power, etc.;Among them, the power determines the capacity of the lithography machine, and the latest light source has reached 120W. Devices designed with short-wavelength light sources typically achieve high resolution.
There is a big difference between the performance of the light source used by the quantity detection equipment and the lithography machine, the main reasons are: the laser light directly irradiates the mask and the photoresist in the lithography process, and the mask detection will irradiate the mask in the process of quantity detection, and the irradiation object of the laser of other measurements is usually silicon, silicide, metal, etc., and its optical properties are quite different; Secondly, the purpose of the work is different, and the photolithography process directly changes the physical and chemical properties of the photoresist; The amount detection needs to avoid the change or damage to the structure of the integrated circuit as much as possible, so the laser energy is generally lower than that of the excimer laser used in lithography. The mask assay uses 135nm 193nm wavelength laser (same wavelength as lithography excimer laser), and 532 355 266 213nm wavelength ultraviolet or deep ultraviolet light is widely used for other quantity detection.
The lithography machine uses a gaseous excimer laser, and the quantity detection equipment usually uses an all-solid-state laser. All-solid-state laser has the advantages of narrow line width, small size, high stability, and excellent beam. Taking the 266nm deep ultraviolet all-solid-state laser as an example, its generation method is as follows: neodymium-doped yttrium crystal produces a near-infrared laser with a wavelength of 1064nm, and then shortens the wavelength to the original 1 4 through the sum or doubling of the frequency of BBO, LBO, KBBF and other crystals, and finally obtains a laser with a wavelength of 266nm. In a similar principle, the NIR laser triples the frequency of the 1064nm wavelength divided by 3 to obtain a 355nm wavelength laser.
The size of defects on the surface of the wafer is small, and there are many types of defective substances, and the high detection rate requires the detection light source to have the characteristics of high brightness and wide spectral range at the same time. In order to meet the above needs, laser maintenance plasma (LSP) light sources have emerged, which are widely used in brightfield defect detection equipment. The LSP light source uses an imported external laser and a curved focusing collector mirror to form an external laser radiation field. The plasma generated by the interaction of the laser and the ionized gas in the high-pressure XE lamp absorbs energy from the external laser radiation field focused in the plasma region and maintains a state close to thermodynamic equilibrium. The plasma emits a plasma laser during the electron transition process inside. The LSP light source has a small size, high energy deposition efficiency, high luminous intensity and longer life of the light source at the same power.
Lasers are widely used in multiple industries, and the global laser market size has grown from 107 in 2016$500 million, up to $160 in 2020$100 million, with a compound annual growth rate of 1047%。Lasers for lithography market size was valued at 12$7.5 billion. With the rapid growth of global shipments of EUV lithography machines, there is a strong demand for DUV lithography machines, and CO2 light sources for generating EUV light and excimer light sources for DUV are expected to promote the continuous expansion of the market size of lasers for lithography. The demand for lasers for mass inspection equipment is also expected to grow simultaneously.
2.3 Camera: The Eye-Catching Eye of Semiconductor Optical Devices
In the process of wafer defect inspection, the required optical signal acquisition is mostly done by time-domain delay integration (TDI) cameras. TDI cameras perform image acquisition in "line" units. The prototype single-line scan camera of the TDI camera had only one line of sensitive pixels, and with the increase of detection speed, the first time of the camera was continuously shortened, and the multi-line sensitive TDI line scan camera gradually became the mainstream. With up to 256 steps, the new TDI line scan camera combines the image data of each line to obtain images with a sensitivity of up to 256 times, thus satisfying the process of detecting quantities in low light conditions, especially in dark field. The use of TDI cameras can also improve the unfavorable factors caused by harsh environmental conditions and low signal-to-noise ratios. In addition, high-speed, large-area industrial cameras with acquisition speeds of up to 90 180 fps are also used for high-end semiconductor 3D measurements.
TDI cameras belong to the offshoot of industrial cameras, with a market size of around 2$500 million, major manufacturers include Japan's Hamamatsu Optics, Germany's Vieworks, Canada's Teledyne, etc. The CIS chip is the core component of the TDI chip. According to Yole statistics, the market size of CIS chips for military aerospace (including scientific instruments) in 2021 will be about 400 million US dollars, and the top six in the industry are Teledyne (41.).5%), onsemi (onsemi 15.)46%）、bae fairchild（8.46%), hamamatsu (Hamamatsu 6.).78%), Sony (Sony 649%), Changguang Xinchen (624%）。
At present, the output resolution of the image sensor of TDI line scan cameras has reached 24K, the resolution of area scan cameras has reached more than 200 million pixels, and the data bit width has gradually developed from the initial 8BI to 10bit or even 16bit. Industrial cameras equipped with FPGA and DRAM chips have further enhanced front-end embedded computing capabilities, and more complex calculations can be realized on the camera side. With the help of pixel shift technology and super-resolution algorithms, the camera can achieve image synthesis at 4x or higher resolution: e.g. in 1On the basis of 500 million image sensors, 600 million resolution image output is realized. In addition to optical quantity inspection equipment: advanced packaging and three-dimensional integrated circuit technology have a strong demand for X-ray inspection equipment with strong penetration and non-destructive power. Compared with area scan cameras, TDI cameras can greatly improve the efficiency of X-ray inspection, partially avoid image distortion caused by irradiation angle, and can also capture images with high signal-to-noise ratio in weak signal environments. TDI cameras have obvious advantages in X-ray inspection, and the scale of demand is expected to increase further.
The application of TDI cameras also has some limitations: its imaging principle has high requirements for lenses and light sources, which increases the difficulty and cost of system development; The TDI camera needs the support of motion control and feedback system, and the object to be detected needs to move at a constant speed during the scanning process, otherwise the image accuracy may be reduced, which will ultimately affect the accuracy of the quantity detection. The motion accuracy and speed requirements of TDI cameras need to be met by an advanced motion stage system.
2.4 Motion Platform Systems & Components: The Key to Precise Movement Positioning
The precise positioning and displacement in the lithography and quantity detection process are realized by the high-precision motion stage (called double workpiece table in the lithography machine) system. The motion platform system has the functions of tooling clamping, transfer, positioning, etc., and can also be used for wafer bonding, wafer dicing and other processes. Taking the workpiece stage of the lithography machine, which is responsible for the wafer movement in the first process, as an example, it has the ability of nano-level ultra-precision motion with high speed, large stroke and six degrees of freedom. The workpiece stage of the lithography machine is made by ASML, Nikon, Canon and other companies, and the motion platform for the measurement inspection equipment is made by third-party suppliers such as Aerotech, Newport, and PI in Germany.
In the case of lithography workpieces, the motion stage adopts a number of special designs to meet the process requirements of semiconductor optics. High lightweight: In order to reduce the motion inertia, reduce the load of the motor, and improve the motion efficiency, the motion platform generally adopts the lightweight structure design, and the lightweight can reach up to 90%; High geometric accuracy: In order to achieve high-precision motion and positioning, the motion table structure has extremely high geometric accuracy; High dimensional stability: the structural parts of the motion table are not easy to be deformed due to temperature or strength; Clean and pollution-free: The motion table has a very low coefficient of friction, low kinetic energy loss, and no contamination by grinding particles. The above-mentioned special design requires a number of key technical supports, such as laser interferometric planar grating measurement, special optical component processing, advanced materials, and multilayer piezoelectric drivers.
Laser interferometers are based on the wavelength of the laser and have high accuracy and traceability. To measure the multi-degree-of-freedom displacement of the motion platform, it is necessary to use multiple laser interferometers to build a multi-degree-of-freedom measurement system. Keysight (formerly Agilent Inc.) and Zygo are important suppliers of interferometers for lithography. The laser interferometer has the disadvantage of a long optical path, and the nanometer error caused by the environment is being partially replaced by the grating interferometry. The grating interferometer takes the grating distance of the grating as the reference, and uses the diffraction effect of the grating to realize the single-point multi-freedom measurement of the workpiece table. Due to the short optical path of the grating, the environment adaptability is strong, which can meet the needs of ultra-precise positioning of 3-5nm process lithography machines. ASML uses the four-grating-four-readhead technology from Heidenhain.
The square mirror of the lithography stage is used to carry the wafer and is also the target mirror of the multi-axis laser interferometer, which is essential for precise positioning. The square mirror has extremely high requirements for the surface shape accuracy, position accuracy, and overall stiffness of the reflective surface, and more than 20 kinds of general and special measuring instruments are required for the measurement of its parameters. In terms of raw materials, the workpiece table body is often made of aluminum alloy or silicon carbide (the performance of silicon carbide is better than that of aluminum alloy); Indysteel as the base of the measuring system; SCHOTT glass-ceramic with excellent mechanical and thermal properties is used in the manufacture of square mirrors. Glass-ceramic is prone to breakage in EUV lithography, resulting in a decrease in accuracy; It needs to increase the thickness while maintaining the stiffness, and the weight cannot be realized; Iolite or silicon carbide ceramics are expected to be alternative materials in the future.
Multilayer piezoelectric drive is another key technology: the application of voltage to piezoelectric ceramics produces displacement deformation, has nanometer displacement resolution, and has the advantages of fast response, small size, high torque, and no electromagnetic interference. Multilayer electric drives are used for lens fine-tuning, mask or motion table position adjustment, active vibration damping, etc. The piezoelectric actuator of the German company PI can achieve sub-nanometer displacement accuracy, microsecond response time, and excellent resolution and stability. Other vendors include Thorlabs, NEC TDK, etc.
Compared to the WPH (Wafer Per Hour) of 300 wafers (Wafer per hour) of a DUV lithography machine. The WPH of the domestic 2xnm node no pattern wafer defect inspection equipment is about 25;The WPH of a single-cavity film thickness device is about 80; The wph of the dark field patterned wafer defect inspection equipment is tens of pieces per hour; Electron beam devices have lower WPH for brightfield pattern defect detection devices. Because the production capacity is less, the displacement and measurement workload of the moving platform of the measuring detection equipment under the same accuracy level are less, and the technical difficulties are relatively less.
3.1 Precision Optics Manufacturing: The birthplace of the core components of semiconductor optical devices
Precision optical manufacturing occupies the core position of the semiconductor optical industry chain, supporting the production of almost all semiconductor optical components. In addition to being used in the semiconductor field, industrial-grade precision optical manufacturing mainly serves industries such as aerospace, life science and medical, unmanned driving, biometrics, and AR VR detection equipment. In the field of semiconductors, extreme ultraviolet lithography is becoming the core technology of integrated circuit manufacturing, and the surface accuracy of optical components is required to reach 200, and the surface roughness is less than 01nm, these indicators reach or exceed the limit of current precision optical processing technology, which belongs to the ultra-precision level. Germany, Japan, and the United States occupy the commanding heights of ultra-precision optical manufacturing technology, and Zeiss of Germany is a representative enterprise of semiconductor global optics. Ultra-precision optical manufacturing is composed of ultra-precision optical processing, ultra-precision optical coating, ultra-precision optical detection, and ultra-precision assembly.
Ultra-precision optical processing is the forming process of optical components, and its technical route is divided into two categories: touch and non-contact. Among the contact manufacturing techniques, the most representative methods are CNC grinding and polishing (CCP), single-point diamond cutting, and magneto-rheological polishing (MRF). In non-contact manufacturing, the main methods include techniques such as abrasive jet polishing, plasma molding, and ion beam polishing. New technologies such as CNC machining technology and computer-aided design are gradually being applied to the field of ultra-precision optical processing, greatly improving production efficiency and quality assurance capabilities, and the classical polishing process is gradually being replaced.
The low-frequency error (33mm spatial period length) in ultra-precision optical processing will affect the focusing ability of the optical system, and the wave aberration will be introduced to reduce the system resolution. IF error (spatial period length 0.).12-33mm) will introduce small-angle scattering, reduce the peak intensity and significantly increase the spot size, and reduce the clarity of the image; High-frequency error (space period length less than 0.).12mm) will reduce the signal-to-noise ratio of the system, resulting in deterioration of image quality. Therefore, ultra-precision optical machining has extremely demanding requirements for precision.
The ultra-precision optical surface coating process can improve the ability of optical components to transmit, reflect, polarize, and resist strong lasers. Precision optical components are developing in the direction of functional integration and high precision, and their performance such as polarization and light splitting, reflection reduction, and accurate positioning of spectral wavelengths (nanometer level) can only be achieved through coating. The main coating methods include: plasma coating, ion beam coating, laser beam coating, chemical vapor phase thin film deposition, etc. Coating technologies such as atomic layer deposition used in integrated circuit manufacturing have also been gradually adopted, which has obvious effects on improving efficiency, yield and reducing costs.
Ultra-precision optical assembly, which is responsible for assembling optical components into optical systems, is another core technology. The complete assembly process includes the assembly, testing, and image quality compensation process of the precision optical system. Taking the objective lens of lithography machine as an example, the assembly interval error and eccentricity error of optical components should be controlled within 1 m. Through computer-aided assembly and adjustment and system-level component refinement, the image quality indicators such as wave aberration and distortion meet the requirements. The assembly and adjustment process requires the support of test equipment, including transfer function test, laser spectrum test, lens thickness test, lens position test, objective system wave aberration test, etc. High-precision center deviation tester, high-precision turning vertical school lathe, lens locator are the key equipment for ultra-precision optical calibration.
Ultra-precision optical inspection measurement technology is another challenge. Through signal acquisition and software analysis, the automatic testing equipment can automatically judge the surface shape and processing accuracy without contact, and the accuracy is high. The traditional optical sample contact inspection (contact contamination and damage to the surface of the component) and the subjective judgment test method of the individual judgment were quickly replaced. Optical processing and testing equipment mainly includes plane interferometer, spherical interferometer, high-precision spectrophotometer, spliced intervening measuring instrument, etc. Among them, the surface shape detection mainly uses the profilometer and the Fisso interferometer, and the roughness detection mainly uses the atomic force microscope and the white light interferometry instrument. While ensuring the quality of optical components, ultra-precision optical inspection provides real-time data parameters of a large number of optical components for the CNC machining system, and assists in guiding processes such as polishing, coating, and molding. Therefore, the optical detection accuracy determines the machining accuracy to a certain extent.
3.2 Optical equipment and materials: micro-nano carved carving knives and essences
Taking Zeiss as an example, the main way of semiconductor optical manufacturing in the early days was the "gold finger" mode: manual experience judgment + manual polishing. However, with the continuous improvement of the semiconductor optics industry's requirements for lens accuracy, the traditional manual production method is inefficient, the processing accuracy and stability are uncontrollable, and the personnel training is becoming more and more difficult. The shortcomings of manual polishing led to a large number of quality problems with the G-line lenses produced by ZEISS in the 1980s for GCA in the United States, which seriously damaged the reputation of GCA and ZEISS, and ZEISS was also in a business crisis. In the 1990s, ZEISS officially introduced the production method of combining polishing robot + interferometer to help the company's development gradually get on the right track; This production method has also become the mainstream method of semiconductor ultra-precision optical manufacturing.
The magnetorheological polishing machine is a CNC high-end optical manufacturing equipment developed in the 1980s. The magnetorheological polishing machine of the American company QED is subject to strict export restrictions overseas. The principle is as follows: after the magnetorheological fluid enters the polishing area, it becomes a viscoplastic medium under the action of the magnetic field, as a "flexible polishing head"; When it comes into contact with the surface of the optical part, it generates a large shear force, which enables the stable removal of the material to be polished. Compared with CNC milling (low precision), CNC small grinding head polishing (unstable polishing function), and stress disc polishing (mostly suitable for large size), magnetorheological polishing technology has the characteristics of wide application range, small subsurface damage, high machining accuracy, and high surface shape convergence efficiency, and is widely used in the production of semiconductor ultra-precision optical lenses.
Ion beam trimming and polishing machine is another advanced optical processing equipment, which is mainly used for error correction of optical surfaces. Ion beam modification can polish without stress and non-contact on the atomic scale, and its principle is: in a vacuum state, the ion source is used to send out an ion beam to bombard the optical surface, and the atoms on the optical surface will be free from the binding of the pendulum surface after obtaining enough energy, resulting in physical sputtering, and the atom of the atomic order material is removed. Ion beam polishing offers high certainty and stability without edge effects and surface and subsurface damage, but with low removal efficiency. The German company NTG is an important supplier of ion beam polishing equipment. There are many types of optical coating equipment, including chemical vapor deposition, ion beam plasma sputtering, atomic layer deposition and other sub-classifications. Germany Bühler Leybold, Japan Guangchi and Japan New Cologne are important coating equipment suppliers.
The ultra-precision optical inspection equipment mainly includes a coordinate measuring instrument (used in the milling stage, and the measurement accuracy is usually about 10 m); Laser tracker and contact profile measuring instrument (used in the grinding stage with an error of about 1 m); Schak-Hartmann sensors (for the initial polishing stage with an error of the sub-micron order), etc. The Fizeau interferometer is a kind of dual-beam interferometer, which uses the reference beam and the test beam to generate interference fringes, and then uses the phase recovery algorithm to derive the surface shape error of the measured surface from the interference fringes. The Fiso interferometer has high measurement accuracy, up to nanometer level, abundant sampling points, and short measurement cycle, and is widely used in the high-precision detection process of optical parts. QED and Zygo are important interferometer vendors.
Glass-ceramic is the main raw material for lenses in lithography machines. During lithography, the lens absorbs the energy of the light and produces thermal aberrations. Glass-ceramic has the characteristics of low thermal expansion, which can minimize lens deformation and ensure optical imaging accuracy; It can also be made in a variety of sizes and shapes, even up to size 4Large 25-meter optical lens. Calcium fluoride crystal has the characteristics of high ultraviolet transmittance, constant average refractive index and local refractive index, stable physical and chemical properties, etc., and is one of the core optical materials in the optical system of lithography machine. Calcium fluoride was originally expected to be the main raw material for 157nm lithography machine lenses, but it was not finally realized because the 157nm lithography solution was abandoned. China's deep ultraviolet lithography grade CaF2 crystals are currently highly dependent on imports.
China's semiconductor optics industry chain started late, but under the joint drive of major projects such as "very large-scale integrated circuit manufacturing", national large optical projects such as laser nuclear fusion and aerospace telescopes, and market demand in the civilian field, China's semiconductor optics industry has made rapid progress. On the basis of lithography and brightfield detection equipment covering 90-65 nanometers, 28 nanometer process equipment is steadily advancing, and the pre-research of the next generation of new principle semiconductor optical equipment has also been launched.
Keyi Hongyuan already has 248 193nm excimer lasers for lithography machines; Innova Laser launched a 266nm laser for detection; The lasers of Jeput and Han's Laser have been used in the field of annealing, dicing and photoelectric detection; Fujing Technology produces crystal components for lasers; AGCO SAIBO participates in the construction of synchrotron radiation light sources, a potential technical route for lithography machines. Echo Optoelectronics, Lingyunguang, Changguangchen Core, Opt production of industrial cameras or CIS chips, can be used in the field of semi-conductive volume detection scientific instruments. Echo Optoelectronics' industrial camera products have been shipped in the field of semiconductor testing.
Huazhuo Jingke's workpiece table for dry ARF lithography machine has been developed and shipped, and more advanced workpiece table is under development. Huazhuo Jingke is also the leading supplier of the first sports platform of Zhongke Flying Measurement. Other domestic sports platform companies include Shanghai Yinguan Semiconductor, Wuxi Xingwei Technology, Tianjin Sanying Precision Control, Wuxi Geocentric Technology, Shenzhen Kronos, etc. SUDVIG manufactures encoders for stage positioning with an accuracy class of 28 nm or higher. In terms of optical manufacturing, Guowang Optics and Guoke Precision undertake the R&D and manufacturing tasks of the optical system of lithography machines, and have successfully developed 90 110nm node projection objectives, which are the leading enterprises in China's semiconductor ultra-precision optical manufacturing. Maolai Optics, Wavelength Optoelectronics, Focuslight Technology, Fuguang Co., Ltd., Fujing Technology, Tengjing Technology, and Optoelectronics have some ultra-precision optical component processing capabilities.
In terms of optical equipment, domestic scientific research institutions and colleges have made breakthroughs in some special equipment such as magneto-rheological polishing machines and ion beam polishing machines. However, judging by the state after the completion of the implementation of the 04 special project, there is still a gap of about 15 years between China's machine tool industry and the international advanced level. In terms of optical raw materials: Chengdu Guangming and other Sichuan enterprises are the main manufacturers of high-end optical glass raw materials in China, and are constantly making breakthroughs in the field of semiconductor optics.
This article is for informational purposes only and does not represent any investment advice from us. To use the information, please refer to the original report. ）
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