Intel abandons the High-NA EUV lithography machine, can it surpass TSMC?
A few days ago, ASML placed an order with Intel for the world's first EUV lithography machine, which attracted a lot of attention in the industry. Just when everyone thought that Intel had beaten TSMC to mass-produce the 18A process with advanced EUV lithography equipment.
Intel CEO Patrick Singer said that Intel will not use high-resolution EUV lithography technology in the 18A processor, but will keep it until the next one"Primally"Node.
18 A refers to Intel's 1The 8nm process, which is the company's primary process to return to chip technology leadership, is also the main equipment for the 2nm process and beyond. But why doesn't Intel use high-frequency EUV lithography at critical nodes? Without the help of EUV lithography, how can Intel regain its leadership in chip technology in 2025?
Why doesn't Intel use the 18A high-nitrogen EUV process?
First, let's take a look at the high-NA type, which is an extreme ultraviolet lithography technique with an ultra-high numerical aperture. This means that it can increase resolution and reduce production costs.
In the chip production process, the resolution directly determines the fineness of the circuit on the chip, and the production cost is an important factor in determining the competitiveness of the product. Therefore, the research and application of extremely high-sensitivity UV lithography is the basic equipment for the future production of chips of 2 nanometers and below.
However, Kissinger said that for risk control reasons, Intel did not use Gauna EUV technology in the 18A process.
Gelsinger believes that risk management is an important part of Intel's elevation of its domestic industry to a world leader. The introduction of high-NA EUV lithography technology may introduce unnecessary risks to Intel's process development and production.
According to Kissinger's explanation, the author summarizes the following reasons.
1.Risk management: Intel may believe that the introduction of high NA EUV lithography technology may pose unnecessary risks as it will make the domestic industry a world leader again. For this reason, Intel has decided to postpone the development of next-generation lithography technology to ensure its stability and reliability.
2.Technology maturity: Although very high nano ultraviolet lithography technology is considered a fundamental technology for future chip production, its technological maturity may not yet meet Intel's standards. Intel may want to ensure the maturity and repeatability of the technology before it goes into production.
3.Production costs: The high cost of acquisition and maintenance of high-resolution EUV lithography machines can put pressure on Intel's production costs. Intel believes that the introduction of a high NA EUV lithography machine at this stage will affect the company's profitability.
Of course, this decision has also aroused the industry's attention to the future development of Intel's technology, and whether Intel will become the focus of attention as much as returning to the field of craftsmanship.
Without the help of high-resolution EUV NA lithography technology, how could Intel have surpassed TSMC and regained the number one spot?
Intel formulated"4 years 5 nodes"strategy, with the goal of beating the giant TSMC to become a leader in chip production by 202518 . However, the last EUV lithography machine that Intel purchased from ASML was not put into service.
Without advanced equipment, what did Intel rely on to regain the world's first place? In fact, Intel has four other advantages.
Intel can further develop its system-level foundry strategy to ensure continuous advancement and leadership in process technology by providing a range of solutions for wafer production, packaging, core materials, software, and more. In addition, Intel can work with 43 potential customers and green partners to test and optimize chip designs.
Intel can leverage architectural innovations to improve competitive advantage. For example, Intel's RibbonFETs, Field Field Transistors, and Powervia Back Power technologies improve chip performance, energy efficiency, and reliability, ensuring Intel's leadership in process technology.
3.Even without the use of high-NA EUV lithography, Intel can improve chip performance by continuously optimizing existing processes. For example, by improving the process flow, increasing the efficiency of the equipment, reducing the defect rate, and continuously optimizing the process flow, the product has a competitive advantage in the process technology.
4.Intel can establish partnerships with well-known enterprises, research institutions, universities, etc. at home and abroad to jointly develop new processes. By partnering with external agencies, Intel has access to technical resources and talent support to facilitate continuous innovation in process technologies.
After all, if Intel wants to regain leadership in the chip industry without high-EUV lithography, it must be prepared and invest more in its foundry strategy.
So, why don't you think Intel is using high-nitrogen EUV lithography now? Feel free to comment.