Intel abandons the High-NA EUV lithography machine, and the possibility of overtaking TSMC is reduced?
Intel received an order for the world's first EUV lithography machine from ASML some time ago, which was highly praised by the industry. When everyone thought that Intel had completed the mass production of the 18-A process using EUV lithography technology before TSMC, rumors soon appeared that the technology would be discontinued.
Intel CEO Patrick Singer said that Intel will not use advanced ultra-ultraviolet lithography technology in its 18-A processors, but will rely on the next one"Flagship"Node.
18a refers to Intel's 1The 8nm process, which is the core process for Intel to regain leadership in the chip industry, is also an important part of its 2nm and sub-process. But why doesn't Intel adopt EUV lithography technology and adopt high-end EUV lithography technology? Without the help of EUV lithography, how can Intel return to the top of the chip industry in 2025?
Why doesn't Intel use the 18-A process for high NA EUV?
Let's start with EUV high-nano lithography, which is a lithography process that uses ultra-high numerical apertures. This means that this approach can improve resolution and reduce production costs.
In wafer manufacturing, wafer resolution is an important factor affecting the quality of circuits on wafers, and production cost is also an important factor affecting product competitiveness. High-sensitivity extreme ultraviolet lithography is at the heart of 2nm or smaller processes, and its research and application has become a key technology for future wafer fabrication.
However, Gelsinger said that Intel did not use Gauna EUV in the 18-A case due to risk control considerations.
Gelsinger believes that one of the keys to Intel's rise from national industry to a world market leader is risk control. He believes that the risks of introducing n-type high-end extreme ultraviolet lithography technology are quite dangerous for Intel's process development and manufacturing.
According to Kissinger, the author summarizes the reasons as follows.
1) Risk management: Intel may take into account the risk factors of introducing a high-NA extreme ultraviolet lithography process in its efforts to revitalize the local industry and become a world leader, which may cause unnecessary losses. For this reason, Intel has decided to postpone the adoption of the next-generation lithography process to ensure its stability and reliability.
2) Process maturity: Although high-nanometer ultraviolet lithography technology is considered a necessary process for future wafer production, the process may not be as mature as Intel's. Intel may want to ensure the maturity and repeatability of the technology before it goes into production.
3) Manufacturing costs: High-end EUV lithography machines are expensive to acquire and maintain, and Intel will face significant manufacturing cost pressures. Intel believes that the introduction of EUV lithography technology at this stage will affect the company's profitability.
Of course, this decision also raises Intel's concerns about future technology – how did Intel re-enter the process?
Without the help of high NA EUV lithography technology, how could Intel regain the throne from TSMC?
Intel released"4 years 5 nodes"strategy, with the goal of surpassing TSMC and other major players to occupy a leading position in chip manufacturing by 2025. The 18-A process is a key one in regaining its leadership. However, Intel has purchased the latest EUV lithography equipment from ASML, but it is not yet in use.
Without cutting-edge equipment, what does Intel rely on to regain hegemony in the field of chips? In fact, Intel has four other strengths.
Intel can continue to evolve its fab strategy to provide turnkey solutions for wafer production, packaging, base materials, software, and more, ensuring that the company continuously improves its processes and remains at the forefront of the field. In addition, Intel has the opportunity to test and optimize chip designs with 43 potential users and environmental partners.
2) Intel's architectural innovations have increased its competitiveness. For example, gate-wound transistors such as RibbonFETs and PowerVia power supplies have helped Intel stay ahead of the curve by improving chip performance, efficiency, and reliability.
3) Even if Intel doesn't have high-nanosecond ultra-UV lithography equipment, it can take it to the next level by continuously optimizing existing processes. For example, improve the process, improve the efficiency of the equipment, reduce the defect rate, and continuously optimize the process to ensure that the product is process-competitive.
4) Intel Corporation can cooperate with leading technology companies, research institutions, universities and other organizations at home and abroad to jointly research new process technologies. Through cooperation with external companies, Intel will receive greater support in terms of technology and talent to promote innovation in the field of process technology.
In conclusion, if Intel wants to regain leadership in the chip field without EUV lithography, it must be ready for everything such as foundry strategy, architecture innovation, technology improvement, engineering improvement, and enhanced collaboration.
What do you think about Intel's yet to launch high NA EUV lithography technology? Please leave a comment here.