If there's one of the best entry-level CPUs on the market, it's APUs. With the advent of the Zen4 CPU architecture and the RDNA3 graphics card architecture, everyone is eagerly awaiting the new APUs.
The first thing everyone is waiting for is the APU on the laptop side or the CPU and APU of the Zen4 Zen4C mobile version - the Ryzen 7945HX that everyone likes beats the i9 14900HX, and a 7945HX3D ends the Intel notebook dynasty, and those who know are looking forward to the desktop APU of the new architecture.
Finally, I finally waited for the new version of the APU for desktops, and this time I got the AMD Ryzen 5 8600G, which I will use to compare the popular mid-range CPU - i5 13400 and GTX 1650 graphics cards, so that everyone can intuitively feel the performance of 8600G and 13400 GTX1650 in games. And the sentence that AMD shouted - there is no need for low-end entry graphics cards to exist!
Like the AMD Ryzen 7040 series on the laptop, the Ryzen 8XXX APU is also equipped with the latest built-in Ryzen AI engine, which greatly brings the popularity of AI and gives AI wings to fly into ordinary people's homes!
The AMD Ryzen 5 8600G comes in the same packaging as the Zen 4 Series Ryzen 8000 Series, but with a slight difference.
There is a see-through window on the front of the box, and you can see the logo of the CPU top cover - AMD Ryzen 5 8600G. The bottom left corner of the box is clearly marked with "8000 Series Processors with AMD Radeon 700M Series Graphics Card".
On the left side of the box, the logo "AMD Ryzen AI" R5 8600G is equipped with the latest Ryzen AI engine, which greatly popularizes AI and gives AI wings to fly into ordinary people's homes!
The side of the box clearly shows the features of the Ryzen 8000 series APUs "Built-in AMD Ryzen AI Engine", "Built-in AMD Radeon Graphics", "AMD AM5 Platform", "Zen4 Architecture".
The 8600G comes with a heatsink and instruction manual, Ryzen stickers, and a Red Squad banner.
The substrate part of the 8600G has changed compared to before, the previous tantalum capacitors and resistors have all been moved to the top cover, and there are no more electronic parts at the edge of the CPU, which can maximize the life of the CPU.
The rest follows the Zen4 architecture, with the AMD Ryzen 5 8600G clearly marked in the middle.
The included heatsink is ideal for emergency use, and if you want to unleash the full power of the AMD R5 8600G, we recommend using a tower fan.
The core of the 8600G is a large core of the full Zen 4 architecture, with 6 cores and 12 threads, and a base frequency of 43 GHz with a maximum dynamic acceleration frequency of 50 GHz, 6 MB L2 L2 L2 L2 cache + 16 MB L3 ** cache, TDP of 65W, the memory controller has also been strengthened, the measured can EXPO DDR5 6800, and even the Great God Auto FCLK on DDR5 8000.
As for the integrated HD graphics card, the 8600G is the Radeon 760M, and it has a hardware spec of 8cu (512 unfied)@28g ，32 rops / 32 tmus。In the 3A masterpiece, it can already beat the 1050Ti at 1080p resolution, and as the driver is optimized, the performance will be gradually released.
The good news is that the January 31st update to AMD Driver will add AFMF for 8600G and 8700G, which will take 8600G gaming to the next level!
Finally, the 8600G 8700G offers 20 PCIe 40 channels, 8 channels for the graphics card.
Most importantly, AMD has an XDNA architecture @ 1The 6GHz Ryzen AI NPU is the first of its kind for a desktop-class CPU. This may seem like a small step, but it's actually a big step in the future to embrace the AI boom. Because AI is not just AI drawing, like Abobe launched the Firefly plug-in on the latest version of PS, with the NPU, even the Radeon 760M integrated with 8600G can complete tasks faster than the CPU without the NPU! What's more, Windows 12 will add a lot of light AI applications in the future, which will allow users of 8600G and 8700G to get started one step ahead and embrace the future AI tide and seize the opportunity.
The same motherboard series, the same heatsink - Kyushu Fengshen Frost Tower Digital Display ARGB Edition (white), and the same chassis Kyushu Fengshen CH560 White, the same heat dissipation grease Kyushu Fengshen DM9, and the same power supply, Antik NE ATX30 850w。
The 8600g + b650 blowing snow on the right side and the 13400 + b760 blowing snow on the left and the back on the left.
In this test, the same memory module was used - Guangwei Shence DDR5 6800 24G*2. Interestingly, although AMD was not very friendly to DDR5 6400 or more in the past, this time the APU 8600G can be tested to expose DDR5 6800 24G*2, and it has run all tests stably.
The heat generation of 8600g is low, so one fan is theoretically sufficient, and 13400 is more recommended because of the small core, so two cooling fans are more recommended.
The Big Frost Tower Digital Display ARGB version looks like when it is a single fan. You can clearly enjoy the ARGB color of the memory module and the ARUA's divine light synchronization of the whole machine.
With dual fans, the flashing lights of the memory are partially obscured. (Simulated with 8600g.) ）
ASUS Blowing Snow Logo The Eye of the Loser is hidden in this corner, which should be more compatible with water cooling.
After installing the app, the actual situation is displayed, with the logo on the left display and the real-time CPU temperature on the right.
The 8600G's CPU and GPU are jointly certified and tested, and in terms of CPU scores, the R5 7500F is stronger. However, the 8600G is an APU, and its core graphics card is very strong! What's more, the DDR5 6800 24G*2 EXPO has been successfully lit up and all tests have been completed! This is AMD's first for ah!
The 13400 score is won by a small core, but there are still many problems with the actual use of the small core. In the professional field, don't touch the big and small cores.
and subsequent CPU-Z + GPU-Z federated validation for 13400 + 1050Ti.
The latest Cinbench R24 performance test. I've always said that high-frequency memory is not much of a boost for high-end consoles, but for the APU 8600G 8700G, the improvement is huge, because DDR5 will also be used as video memory, which will greatly improve the performance of the HD graphics card!
However, due to the bonus of the small core, the 8600g multi-core score is slightly weaker than the downside. However, the single-core score of 8600G is stronger than that of 13400, which actually proves the excellence of the Zen4 architecture.
3DMark Night RAID performance test for integrated graphics projects. The 8600g Radeon 740m and the UHD730 with 13400 were expected, but the 13400 + 1050Ti was a big surprise. Whether it's the graphics project, or the overall score, 8600g is even better.
In the Fire Strike project test for DX11 games, the 8600G once again came out on top. Both the total score and the graphics sub-sub-score surpass the combination of 13400 + 1050ti.
3DMark Time Spy performance test for DX12. 8600g leads even more! The graphics card score is directly ahead of the 1050ti by about 10%.
Of course, in these tests, Guangwei Shence Expo DDR5 6800 24G*2 8600G + B650 blowing snow is a great contribution, and they fully reflect that with the increase of memory bandwidth, integrated graphics are the biggest beneficiaries!
AIDA64 Memory-Level Cache Project Testing. AMD's memory controller optimization is indeed not as good as Intel's, but it is also related to the product positioning, like the 7900x 7950x, their memory performance is not weaker than Intel in the same class.
However, the memory performance is not enough in front of the large-capacity, high-performance L2 + L3, and the 8600G has a larger and faster L2 + L3, which can have a better actual experience.
Tests like 7-zip visually show that L2 + L3 with high capacity + high speed will give you more than the performance boost that memory brings!
Compared to the SSD tested, the WalkDisk WN20 Pro 2TB, it runs on PCIe 40 x4 。Of course, currently the 8600G only supports PCIe 40 x4 SSD....
Measured on the same SSD dual platform. On sequential read projects, the AMD Zen 4 architecture brings out the full performance of an SSD. It's also more stable on sequential writes.
The AMD Zen 4 architecture 8600G is also better on sequential 4K writes, but on the 4K random single-threaded test, 8600G is weaker, but fortunately, this situation is less common in daily use**.
In the 3DMark storage project test, the WalkDisk WN20 Pro 2TB is almost the same as the TiPlus 7100 2TB, which can be used as a storage medium for games, systems, professional applications, and AI software, providing users with an extremely excellent ultra-smooth experience.
The game uses a video replay of the video ESL One Final AR vs GG 5. The Dota 2 game screen is set to the highest effect. The game resolution is 1080p.
The biggest surprise for me with 8600G is that the integrated display has conquered the highest special effects under 1080p, and it is still not open FSR and AFMF and other technologies! This is an epoch-making improvement!!
89.An average of 5 fps, which is an epoch-making fluency value.
LOL This game is actually just a small scene, after all, the farthest 2400g can be played smoothly.
Come to the exciting 3A masterpiece test. So far, Assassin's Creed Valhalla's three games have only been played with minimal special effects. However, after the addition of AFMF in the later stage, 8600G should be able to turn on medium or even high special effects.
The 8600g continued its strong run and beat all its rivals.
In fact, F1 22 supports dynamic real-time ray tracing, and it can't be turned off. The good thing is that it supports FSR21。Uniform settings to FSR21 Quality mode, sharpness 50, minimum effect at 1080 resolution, measured. The 8600g is slightly ahead of the 1050ti. At the same time, it also shows that 8600G can actually be appropriately opened for higher special effects, especially with the blessing of AFMF in the later stage.
In Ubisoft's Farcry 6, the minimum effect is turned on at 1080p resolution, and the average frame rate of 8600g is stronger than 1050ti according to benchmark.
Forza Horizon 5 opens FSR 21 quality mode, sharpness 05 , 1080p resolution Minimum special effects. Measured with benchmark. It's also one of the games with the most outrageous gaps. The 8600g is a big lead over the 1050ti. If AFMF technology is added in the later stage, then you can turn on medium or high special effects!
b The masterpiece "Starry Sky" was measured. Intel graphics cards and integrated graphics cards have become the tears of the times! Because it doesn't support it! It can't be started, and B said that it won't be supported later. At 1080p minimum effects, with FSR quality mode on and 50 sharpness, the 8600G is a notch ahead of the 1050Ti. If you add AFMF in the later stage, you can try medium special effects.
Borderlands 3 comes with a benchmark, so turn on the minimum effects at 1080p to get started!
The 8600g is one position ahead of the 1050ti, which is considered a gear.
Cyberpunk 2077" tested, at 1080p resolution, the lowest special effect is turned on, fsr 21 quality mode, sharpness 05。The 8600G is 2 levels ahead of the 1050Ti with the same setting, and then the AFMF technology is superimposed, so the image quality of the game can be appropriately increased, or the sharpness can be improved.
Stable Diffusion AI painting is the most accessible free and open-source AI project for the majority of users. Previously, the entry cost of AI painting was quite high. Since the introduction of Ryzen AI NPUs, the popularity of AI has been greatly increased, and more people have the opportunity to try AI.
This test uses the same prompt words and settings, and with the blessing of the Ryzen AI NPU, what can AMD 8600G perform under Windows 11?
In fact, in order to fully exert the strength of AMD graphics card AI drawing, the Linux system must be configured with the ROCM platform to exert its full strength, which can theoretically improve performance by up to 10 times).
The same forward prompt word and reverse prompt word, the same setting, repeat 3 times**, record the time, and calculate the average value.
This is the total amount of time it takes for 8600G Stable Diffusion AI to draw 3 times.
This is a summary graph of the results generated by 13400 under the same prompt word.
The measured results show that the average time taken for three trips of the 8600G core graphics card Radeon 740M is 609 seconds. The UHD 730 UHD 730 with 13400 has an average time of 3683 seconds. Therefore, the measured AI painting performance of the 8600G GPU is 6 times that of the 13400 GPU. It's also a performance boost from the Ryzen AI NPU!
A large part of the power consumption of 8600G is allocated to the core graphics card, but in terms of standby and CPU full load, the 13400 has no advantage. The 8600G core graphics card Radeon 740M is stronger, so it is natural to eat more power consumption, of course, he eats grass and squeezes out milk.
As for the actual temperature, the maximum temperature of the CPU measured by 8600G is 73. This is achieved with the blessing of the excellent Big Frost Tower Digital Display ARGB Edition dual fans.
Finally, let's try out the new version. The AFMF option is included in the HYPR-RX mode, which will enable RSR by default, if it is consistent with the highest resolution of the display, then RSR does not meet the conditions for enablement.
AFMF is a driver-level optimization that is a global policy setting for the computer. AFMF enables games only if the game supports full screen.
Starry Sky AFMF Measurements. As originally set, turn AFMF on and off to see how it affects the actual smoothness experience.
After AFMF is turned on, the measured fluency has improved by nearly 74%.
Cyberpunk 2077 keeps the original settings, turning on AFMF for testing, and turning on AFMF can bring 535% fluency improvement.
AMD Ryzen 5 8600G, as a new generation of APU, follows the advantages of the Zen4 architecture in CPU performance, and its core graphics card is more eye-catching, with the blessing of Guangwei Shence DDR5 6800 24G*2 EXPO, the performance is completely ahead of the 1050Ti in 3A masterpieces. AFMF will be available on the January 31st driver update, when 8600g and 8700g will be supported. Through the current measurement, AFMF has brought about 53% fluency improvement in "Cyberpunk 2077" and 74% fluency improvement in "Starfield", which is an epoch-making technology.
The emergence of 8600G has greatly increased the threshold of low-end graphics cards, and Intel's CPU with integrated graphics has become the tears of the times.
Ryzen 5 8600G: The initial price is 1749, and it will be sold on the first day of the first day on January 31***1699.
The motherboard used the ASUS mid-range ATX board - B650 Snow Blowing WiFi for this test motherboard. The packaging style of this motherboard is very close to the X670E blowing snow, if there is a difference, it is the difference between the motherboard model and the motherboard product picture.
On the back is the feature display area of the product.
B650 Blowing Snow perfectly inherits the design idea of the Blowing Snow series, with a silver-white heat dissipation armor and a black motherboard, with the beauty of splashed ink landscapes. The motherboard is solidly made, the materials are high-quality, the circuit design is reasonable, the electrical performance is excellent, and the compatibility is excellent. Three mThe 2 SSD connector allows users to have more areas to install for high-speed SSDs and enjoy faster response times. The 6-layer 2-ounce copper PCB gives the motherboard more space for cabling and makes the motherboard's electrical performance more stable and excellent.
The motherboard's VRM thermal guard is very thick and huge, and the CPU's external power supply port is 8+4 pin ProCool power booster, which is enough to cope with the CPU power supply demand from 7900X down. The 4PIN and ARUA ARGB +5V +12V are distributed around the CPU, which is convenient for users to access the fan and ARGB signal of the heatsink nearby. In addition, a 4pin fan pin connector dust jacket is included to protect users from dust.
Install the 8600g first. The B650 is designed with 12+2 Digi+ digital power supply modules, each of which is equipped with high-quality alloy chokes and durable solid-state capacitors, which can provide stable and pure power to the CPU and help the CPU unleash its full performance.
2 sets of dual-channel DDR5 DIMM slots, the official nominal support DDR5 7600 (OC), the maximum support capacity of 192GB, but this time 8600G measured DDR5 6800 24G*2 EXPO has no problem, and there is even a great god directly Auto FCLK directly up to DDR5 8000. High-frequency memory is a great performance bonus for APUs!
ASUS has equipped the memory with AEMP Memory Super technology, which can automatically overclock and optimize the frequency, timing, and voltage of the memory, so that users can enjoy performance improvements with just one click.
The very user-friendly graphics card detachable keys of the Snow Blowing series are also equipped on the B650 Snow Blowing Series. The large heat dissipation area of the PCH heatsink has ROG Strix logo on it. The side of the PCH has a single-row 4* SATA 6Gbps interface, as well as a slave USB 20 、usb 3.0. USB-C expansion pin connectors, and other power supply or signal line interfaces.
There are three m. in the lower half of the motherboard2 NVMe SSD slots and equipped with thick thermal guard. The main graphics card slot is PCIe 40 x16 hardened graphics card slots, plus 2 * PCIe x1 expansion slots, and PCIe full-size expansion slots.
M. directly connected to the CPU2 slots are m2 pcie 5.0 x4 interface for future PCIe 50 x4 SSD with an extremely thick M2 Thermal Armor. SSDs up to 2280 in size are supported here and are equipped with M2 Convenient buckles.
I'm equipped with a large-capacity M. for the game with AI this time2 SSD – The WalkDisk WN20 Pro 2TB is easily installed with a convenient snap.
The next two are the m. of the pch extension2 pcie 4.0 x4 interface and equipped with m2 Convenient buckle, convenient for users to install m. without tools2 ssd。
The onboard sound card is the ALC4080 from Realtek, which ASUS is equipped with an audio cable and audio cover, which can be paired with high-quality audio capacitors and S**iTech to output pure audio for users. Combined with the "Two-Way AI Noise Cancellation" feature in the Ultron Center, users can present excellent high-fidelity audio effects and two-way noise reduction in and out of audio.
The interface area is already pre-installed with a baffle. There is an HDMI DP display output that is required for 8600G, as well as 3 * USB 30 10Gbps interface. In addition, there is 4*USB 20 interface, one of which can be matched with a button to achieve no CPU flash BIOS, to achieve rapid product upgrade in the later stage.
There is a USB-C 10Gbps port and a USB-C 20Gbps port on the back.
The network interface is equipped with 2The 5G wired high-speed network interface and WiFi 6E support wireless network card can be more flexibly adapted to the environment.
Onboard sound card support 71-channel output.
The WiFi extension antenna can be adjusted from multiple angles to facilitate users to receive a better signal.
There are a wide range of accessories, including stickers, manuals, warranty cards, ROG membership guides, and more, that are both stylish and functional.
It's too fast to get on the plane. I forgot to shoot PDD to buy 13400 for 1280 yuan. Let's take a look at the B760 Blowing Snow.
In order to be fair, the motherboard uses the same series of motherboards, and the Intel 13400 platform uses B760 to blow snow. Its outer packaging style is the same as that of the B760 Small Snow Blowing and Z790 Snow Blowing series, and the details are different.
The workmanship of the B760 Snow Blowing is also very solid, and at first glance it looks very similar to the B650 Snow Blowing Machine. After all, both have the same CPU power supply area configuration. It also has 3 m2 slots, the motherboard is also equipped with m2 Thermal Armor. PCIe 5The 0 x16 graphics card slot has also been reinforced. The motherboard's electrical performance is excellent, and the compatibility is excellent.
The 8+4 pin ProCool CPU strengthens the power connector, and the CPU cooling module is also thick and has excellent heat dissipation capabilities. User-friendly graphics card with easy-to-detach keys with m2 The convenient clasp also appears on the motherboard. The memory slots are also equipped with AEP II technology, and the RC Center supports the same outstanding features.
Remember the brilliance of the DDR4 popularization pioneer? DDR4 3600 8G, which was the first to be 199 yuan a piece, directly made DDR4 still very close to the people**. At that stop, Guangwei also made a name.
Today, DDR5 memory, which is an important enabler of the APU 8600G and 13400 platforms, will be equipped with Guangwei's Shence DDR5 6800 24G*2.
Guangwei Shence DDR5 6800 24G*2 uses Hynix's original M-Die granules, the quality is very good, ** is only 799 yuan, which can be said to be full of cost performance.
As soon as you open the inner box, you can see the DIY installation artifact - gloves that come with Guangwei. As well as the original design manuscript of Guangwei Shence, it is very stylish.
The inner box is also a protective box for the memory, which can maximize the protection and security of the memory during transportation.
The design style of Guangwei Shence is deeply rooted in the essence of modern simplicity, and the simple lines outline a very elegant shape. That touch of vibrant orange is the finishing touch, and it highlights the Guangwei logo and the DDR5 logo. The overall white shape of the memory is very in line with the current fashion trend and is very versatile.
It can be seen from the side that the Shence DDR5 24GB is a single-sided PCB memory. Coupled with the M-Die, which has good overclocking potential, it can be used even more effectively in the hands of experts. The thermal vest is very thick and has wavy lines, which can maximize the use of the case air duct to dissipate heat and maintain the stable operation of memory.
You can also see the light blue high-performance silicone grease heat dissipation gel, which can quickly transfer heat from the DRAM particles and PMIC to the heat dissipation vest.
The heat dissipation vest of Guangwei Shence is made of copper vapor chamber and aluminum armor copper bone, which is an excellent design with both mechanical strength and ultra-high heat dissipation performance, which can make the memory run more stably at high frequency.
Guangwei Shence DDR5 is equipped with ECC On-Die technology, which can correct data errors caused by high-speed reading and writing, so that the system can run more stably.
The light guide strip at the top can be seen on the front, and the memory has an excellent ARGB field of view when powered on.
On the back of the memory, there is a nameplate sticker detailing the XMP Expo parameters and capacity of the memory, which is also a warranty certificate.
The memory is equipped with a PMIC chip, which can finely control the voltage, so that the memory can be at peak performance for a long time.
The light guide strip is designed with multiple layers of nesting, and it can be used to create a jelly-like ARGB lighting effect when powered on, which is unforgettable.
Smooth, three-dimensional ARGB jelly-like visuals, paired with a crystal clear shell, just like the jelly you ate in childhood.
The visual effect on the top is also very unique, and its dazzling colors are very eye-catching.
The SSD is powered by WalkDisk WN20 Pro 2TB. As a new domestic SSD brand, WalkDisk is the main control of the domestic Lianyun, and the particles are from the original particles of the domestic light - Yangtze River Storage, although the brand is not resounding enough to resound in the world, but the quality is still very reliable.
There is a nameplate sticker on the front of the SSD, which clearly indicates the capacity and model of the product.
The back of the SSD is a glossy PCB. The WalkDisk WN20 Pro 2TB centralizes all electronic components on the front for easy heat dissipation.
Gently remove the nameplate sticker, you can see the true appearance of the product, and sure enough, it is the light of domestic production - Zhitai Tiplus 7100 2TB....
The main control is the same as the TiPlus 7100, and uses the MAXIO MAP1602A-F2C of the domestic Lianru Technology. The MAP1602A master adopts a 4-channel design without external cache, adopts a 12nm process, and supports PCIe Gen4x4 NVMe 20 connection** standard, using Arm R5 high-performance CPU core, no DRAM cache can be released PCIe 40 Performance.
NAND particles are the original particles of Yangtze River Storage, which should be the signature crystal stack XTACKING 30 The latest generation of flash memory chips, a single 512GB, a total of four to form 2TB.
This 8600G test can be said to be at the right time, I just bought the Toshiba 18T Enterprise Helium Charged CMR HDD on JD.com. This hard drive is a professional enterprise-grade Seiko quality, the first choice for large-capacity, ultra-stable warehouse disks, and this is very cost-effective, which can be used to store a lot of professional and gaming materials with peace of mind.
There is a positioning introduction of the product on the back of the box, which is convenient for users to purchase according to their needs.
In addition to the enterprise-level helium-filled HDD MG09 18TB, there are also fastening screws and matching screwdrivers, high-quality SATA 6Gbps data cable, and product manuals.
At present, the most stable and reliable technology of ultra-large capacity hard disk is helium filling and excellent sealing technology to achieve ultra-large capacity density, so the shape of the hard disk is different from the traditional hard disk. In order to ensure that the helium inside the hard drive is fully sealed, Toshiba uses precision laser welding technology to seal the helium inside the 9-disk mechanism, which can reduce the aerodynamic resistance, thereby reducing the power consumption of operation.
Vertical CMR technology, coupled with helium filling technology, makes the spacing of the 9-disk mechanism sufficiently small, and the volume of the hard disk is not significantly different from that of the 6T class of hard disk. As an enterprise-class hard drive, Toshiba is equipped with power-off data protection technology and a high speed of 7200 rpm on the hard drive, making the hard drive have outstanding data transfer, throughput, and storage capabilities, and at the same time, it also has extremely reliable security.
The nameplate of the hard disk is clearly marked with the model capacity of the product and the specifications followed in production.
If we talk about the pearl of the high-tech manufacturing industry, there must be the most brilliant pearl of mechanical hard disk, which can be called the human race in the field of machinery to challenge the current physical limits.
On the back is a flip-over circuit board, which protects all important components.
As an enterprise-class hard drive, the MG09 18TB helium-filled hard drive is equipped with a shock-resistant RV sensor, which can counteract the resonance effects of nearby hard drives or fans, so that the hard drive can run stably in a variety of environments.
HDTune Pro performance was measured, and the maximum speed was recorded at 2840 mb s and an average speed of 2198 mb s and a minimum speed of 1152 mb s , access time 127 ms with a burst rate of 2853 mb/s。The test curve is shown in the figure. The Toshiba MG09 18TB is the current flagship enterprise-class hard drive for HDDs, and it is fast enough to be proud of the crowd.
Although the Toshiba MG09 18TB is the benchmark level of HDD, IOPS is not HDD's strong point, and the HDD limit is the physical limit of multiple heads.
Additional test of Toshiba MG09 18TB. As you can see, as long as the MG09 is within its comfort zone, it can burst out with strong performance, so the Toshiba MG09 18TB can have a very good experience with an SSD.
Toshiba MG09 18TB Crystal Diks Mark 1gib Test Block Performance Test, you can see the full range performance of MG09 18TB.
The demo mode allows you to intuitively feel the burstable performance of the Toshiba MG09 18TB in daily use, which can take on the maximum amount of gigabit broadband at present.
In order to ensure the fairness and impartiality of the test, and at the same time prevent the radiator from being dismantled and affecting the test results, I specially prepared two identical twin tower air-cooled radiators - Kyushu Fengshen Frost Tower Digital Display ARGB White Edition. As an iterative upgrade of the classic Big Frost Tower, the AG620 digital display version integrates all the advantages of the Big Frost Tower, and has a cooler appearance and a digital display screen on the top, which can visually display the temperature of the CPU. This is very APU-friendly.
There are detailed parameters of the product on the back. It is worth mentioning that the ARGB version of the Big Frost Tower Digital Display is precisely designed in terms of volume, so that it has excellent hardware compatibility, and can be adapted to vertical or horizontal matx, ATX and other common chassis on the market.
The Big Frost Tower Digital Display ARGB Edition has a feeling of Ice Cube 620 + Big Frost Tower + Top Digital Display Hybrid. The heatsink is a dual-tower structure, which is very compact and can be compatible with high-memory modules and large-size graphics cards.
The composite connection method of buckle FIN + fold FIN is used between the heat dissipation fins, which can maximize the spacing between the heat dissipation fins. The heat sink fins are connected to 6 bidirectional constant thermal balance heat pipes using through-FIN technology, with a 95% and 99% fin penetration rate.
The heat dissipation tower body adopts anodizing process, which has excellent appearance and excellent oxidation resistance.
There are two digital display screens on the top of the radiator, one shows the Kyushu Fengshen logo, and the other displays the CPU temperature in real time, which is convenient for users to perceive in time.
The pure copper base is soldered to 6 bidirectional constant heat balance heat pipes. The base is slightly convex to maximize the contact area with the CPU surface for faster heat transfer.
Both fans are equipped with hydro bearing bearings, which are very quiet when fully loaded. The fan has a colorful ARGB, which can be synchronized with the apps of major motherboard manufacturers.
The full-platform buckle can be used on the mainstream platform on the market when you buy it, and it is very simple to install according to the ** manual!
In order to make the test results more stable and reliable, I used Kyushu Fengshen Assasin IV special silicone grease - Kyushu Fengshen DM9 Master Silicone Grease, which has the advantages of excellent thermal conductivity, easy application, safety and non-corrosive to electronic components.
Inside, there are DM9 Master Silicone Grease, Silicone Grease Scraper, and Silicone Grease Cleaning Kit.
The application process of silicone grease is smooth, the difficulty of getting started is very low, and it is easy to control when it comes to new products. The silicone grease cap is tightly sealed and easy to open.
In order to make the test process fast, reliable and stable, I used my daily test power supply - ANTEK NE ATX30 850w。This power supply can be said to be a small test of dragon slaying for this test. Thanks to its support for ATX 3With 0 and 4 single-to-one PCIe (6+2) pins, it is ideal as a test power supply from entry-level to mid-to-high-end. This power supply comes with a 10-year warranty to replace it.
Antik NE ATX30 850W is the standard ATX power supply size, and its compact size gives it better compatibility, and it can be installed in commercially available MATX and ATX chassis, as well as some ITX models. The fan in the middle supports ECO intelligent temperature control mode, which can minimize the operating noise of the power supply.
Fully modular interface for power supply, ATX 30 The iconic +12HPWR 16pin power connector is configured in the upper left corner, in addition to 4 PCIe 8pin ports and CPU dual 8pin ports, which can be compatible with the needs of mid-to-high-end platforms.
It is worth noting the ANTEK NE ATX3The 0 850W +12HPWR 16pin interface and the corresponding module line support 450W, and can support up to 4080 Super Oh If it is 4090 4090D, then you need NE ATX30 1000w this one.
The standard module cable is moderately soft and hard, which is very convenient for cable management, and the PCIe (6+2) PIN power supply cable is one-to-one, which is very suitable for high-end A cards.
The chassis adopts the Kyushu Fengshen CH560 white digital display version. The chassis has excellent chassis ducts to maximize the test platform for the APU 8600G and 13400 (1050Ti), and its compatibility speeds up the testing process and reduces the time required.
The other side panel of the chassis is SECC, which can cover the messy backline part and shield the electromagnetic waves inside the chassis, providing a safe environment for the chassis and users.
The hardware architecture of the case is excellent, it can be compatible with dual 360 liquid cooling, it can also be compatible with ATX motherboards and extra-long graphics cards, and the case comes standard with a graphics card support bracket to achieve a third point of support for the graphics card.
At the bottom of the case is the power supply hard disk compartment, and there is a digital display screen in the upper right corner of the power compartment, as long as you open the app, you can try to display the temperature and load of the CPU and graphics card.
The backline space of the case is excellent, and there is a very good backline matching system. Chassis support 4 25-inch drive bay or 2 25-inch hard drive bay + 2 * 3The 5-inch hard drive bay can meet the needs of most users.
Since the APU 8600G is an integrated graphics card, this test cannot be displayed in the GPU area, but its temperature is summarized in the CPU area, and the actual use temperature of the entire 8600G can be known through the temperature of the CPU, which does not affect the experience at all.
Ambilight in the dual-fan version.
The single-fan version of the Big Frost Tower Digital Display ARGB Edition allows you to intuitively feel the beauty of memory.