Indium Corporation will be showcasing high-reliability gold-based precision chip bonding (PDA) preformed solder lugs for critical laser and RF applications at SPIE WEST in San Francisco from January 27 to February 1. SPIE West is the world's premier event for lasers, biomedical optics and biophotonics, quantum and optoelectronics, Indium Corporation is one of the top solder vendors for laser and optical applications, and gold-based alloys are the best choice for high reliability in high melting point die bonding applications. In addition to meeting high reliability, harsh application environments, and electrical requirements, gold-based solders offer excellent corrosion and oxidation resistance. Diode laser chip bonding applications require ultra-high-quality, ultra-precision preformed solder lugs to ensure consistency and repeatability in the packaging process, thus guaranteeing the reliability of the final product. Indium Corporation's gold-based PDA preforms meet these requirements – the highest product quality, ensuring optimal performance and reliability in chip packaging applications. Features & Benefits:
1.High-precision thickness control.
2.Precise edge quality.
3.Cleanliness optimization.
4.Packaging designed specifically for gold-based alloys.
Aultra 75 is a non-eutectic gold-tin alloy solution (75Au 25Sn) for chip packages with thick gold plating to improve the reliability of intermetallic compounds, and is widely used in applications such as military, aerospace, medical devices, RF, high-power semiconductor devices, optoelectronics, and lasers. Aultra 75 brings the solder joint composition closer to the gold-tin eutectic point and improves wetting and voiding by adjusting the alloy ratio. The Aultra product range also offers 78AU22SN and 79AU21SN alloy compositions to meet different application needs.
In addition, other gold-based products including solder wire, solder paste, preformed solder lugs, solder balls, (evaporated) metal particles and ribbons can be provided, all of which can ensure high precision and strict quality control, the most common 80Au 20Sn alloy is an important high-temperature lead-free alloy in the microelectronics industry, with a melting point of 280°C, which is widely used in chip soldering or sealing. With good thermal fatigue resistance, it is used for applications with high tensile strength and high corrosion resistance, and the advantages of gold tin solder are as follows:Features & Benefits:
1.Highest tensile strength of any solder.
2.High melting point, unaffected by subsequent reflow soldering.
3.Superior thermal conductivity.
4.Corrosion resistance.
Also on display is the indium-based thermal interface material (TIM), Heat-Spring, a compressible, non-reflowable metal TIM, which is ideal for TIM2 applications, and the thermal conductivity of indium** TIM is much better than that of non-metallic materials, with a thermal conductivity of up to 86W MK. In addition, the properties of the metal material make it possible to apply without the extrusion and cracking problems common with general silicone greases. Read more
With the world's leading core technology, Aultra Thinforms products are widely used in high-power, high-temperature soldering packages of major manufacturers, taking into account reliability and material cost.
The new processing technology of gold tin preformed solder lugs is very thin, the thinnest can reach 000035 inch (0..)00889mm）
0.00035 inch (0..)00889mm) and 0002 inches (0..)0508 mm), so thin!
From the above two pictures are enough to prove that Indium Company's process ability is high, "thin as cicada wings" is no longer enough to describe its thinness, the thickness is only less than 1 20 of cicada wings! In addition to the thinner gold tin preforms will greatly improve heat conduction and reduce power consumption, resulting in improved die efficiency and product life, in addition to indium Corporation's gold tin preforms can also reduce the amount of solder used and the occurrence of wick effects.
heat-spring®
Many applications require thermal interface materials to be placed on the chip lid or to be in direct contact with heat sources and coolants. In response to this need, we have developed a metal thermal interface material, Heat-Spring, a compressible material solution with a pressure range of 35 psi to 100+ psi.
SMA-TIM (soft metal alloy) made from pure indium provides uniform, low interfacial thermal resistance, even at lower pressures. The patented heat-spring surface treatment technology further reduces the interfacial thermal resistance.
Pure indium has a long service life as a thermal interface material, and because SMA-TIM products are made of metal, there will be no cracking or extrusion problems during long power cycles. If you want to know the details of the above products, you are welcome to contact us through the original text at the bottom left (leave your name, region, ** so that we can arrange the corresponding regional manager contact), we will get in touch with you as soon as possible! 
Indium Corporation is a leading global refiner, refiner, manufacturer, and leader of materials serving the global electronics, semiconductor, thin film, and thermal management markets. Its products include soldering consumables such as solder products and fluxes, brazing, thermal interface materials, sputtering targets, metals and inorganic compounds such as indium, gallium, germanium, tin, and nanofoil. Founded in 1934, Indium Corporation has technical support facilities and facilities in China, India, Germany, Malaysia, Singapore, South Korea, the United Kingdom, and the United States.