ChipsThe manufacturing process is complex and requires a lot of materials, equipment, and processes. At the moment, the United States dominatesedawithSemiconductorsIn the field of equipment, Japan dominatedSemiconductorsIn the field of materials, the Netherlands dominatesLithography machineField. Since China is inChainChina does not have the advantage, the United States rightChinese chipsThe industry has been blockaded and contained. In such a situation, we urgently need to establish independenceChainto reduce dependence on foreign countries. And in this domestic productionChainMedium,SemiconductorsEquipment is a vital part. In the face of the blockade restrictions in the United States, if we only use domestic equipment and do not rely on imported equipment, will we be able to produce how many nanoscales?Chips, becoming a worthwhile question.
Wafer fabrication is the conversion of raw material sand into siliconWafersprocess. We can currently manufacture silicon with a diameter of 300 mm using domestic equipmentWafers, and 300 mm of siliconWafersIt can be used to make 2 nanometers or lessChips。Therefore, wafer fabrication is not something we need to worry too much about.
Amplification: Wafer fabrication isChipsA crucial step in the manufacturing process. 300 mm of silicon is manufactured using domestic equipmentWafers, not only to meet the current level of technologyChipsmanufacturing requirements, but also has a certain potential for future development. 300 mm siliconWafersThe manufacturing needs to involve a number of complex processes, such as sand purification, single crystal growth, etcWaferscutting, etc. By continuously improving the performance and technical level of domestic equipment, we can ensure the continuous stability of wafer manufacturing and provide a good foundation for subsequent processes.
The previous process is to willChipsThe circuit diagram passesLithographyBurn to siliconWaferson the process. This process involves lithography, etching, cleaning, etchingIon implantationand other steps, among which the coreSemiconductorsThe equipment is mainly used in the lithography process. As shown in the figure, domesticSemiconductorsThe technical level of the equipment is uneven. High-end etching machines have reached 5nm or even less, but some devices are still stuck at 14nm, 28nm or even 65nm. According to the barrel theory, the whole level depends on the shortest board, that isLithography machine。Therefore, if only domestic equipment is relied upon, theoretically, oursSemiconductorsThe manufacturing level can only reach a maximum of 65 nanometers.
Expansion: The previous process isChipsOne of the key processes in the manufacturing process. Through lithography, etching, cleaning andIon implantationand so on, we willChipsThe circuit pattern is burned to siliconWafersAbove. This requires high precision and high stabilitySemiconductorsequipment to finish. DomesticSemiconductorsThere are large differences in the technical level of the equipment. In some high-end etching machines, processes of 5nm or even smaller have been achieved. However, there are still some devices that stay at larger process nodes, such as 14nm, 28nm, or even 65nm. Lithography machineAs a key piece of equipment in the entire front-end process, rightChipsThe level of manufacturing has a decisive impact. Therefore, if only domestic equipment is relied on, oursSemiconductorsThe manufacturing level can theoretically only reach a maximum of 65 nanometers.
The latter process is mainlyChipspackaging and testing. Compared with the previous process, the subsequent process is not a key bottleneck in the technical level. DomesticChipsWe have always been a global leader in packaging and testing, which means that we don't have to worry too much about the back-end process.
Expansion: The post-process refers to the rightChipsof the package andTesting process。Encapsulation is the silicon that passes the die (through the previous processWafers) into the encapsulation material to form a completeChipsStructure. The test is rightChipsCarry out functionality, performance andReliabilityand other aspects of testing and validation. Compared with the previous process, the subsequent process is not a key bottleneck in the technical level. DomesticChipsWe have been at the world's leading level in packaging and testing, and we are able to meet high quality with strong technical strength and practical experience in scientific researchChipspackaging and testing requirements, for:ChipsThe final delivery provides a strong guarantee.
Based on the above analysis, theoretically speaking, if only domestic equipment is used and does not rely on any imports, China'sSemiconductorsThe manufacturing level should be around 65 nanometers. However, there are still many unknown factors whether this level can be achieved in practical applications, such as the compatibility of equipment, the adjustment of production lines, and production control software. To achieve a higher levelSemiconductorsmanufacturing, we need to further improve domestic productionSemiconductorsThe technical level of the equipment and the perfection of the industrial chain. Only when oursSemiconductorsWhen the equipment as a whole reaches the level of 7 nanometers, we can truly get rid of the shackles of external blockade and make up for itChipsThe shortcomings of manufacturing to achieve independent and controllable development goals.
ChipsManufacturing is modernTechnologyOne of the cores also carries the country'sTechnologyStrength and competitiveness. The current situation requires us to reduce our dependence on foreign countries, strengthen independent research and development and innovation, and establish competitive domestic productionChain。Although at the moment we areSemiconductorsThere is still a gap in the field of equipment, but through the joint efforts of the whole society and the support of the world, I believe that we can gradually narrow the gap with the international advanced level, and actively seek international cooperation and exchanges to promote our countryChipsThe development of the industry. In the future, I look forward to my country's ability to do soChipsA major breakthrough has been made in the field of manufacturing, realizedChipsAutonomous and controllable, for the countryTechnologyProgress andEconomyContribute to development.