As the performance and energy consumption of thin and light notebooks and smartphones become higher and higher, how to improve the active cooling design has become a new problem. At last month's CES 2024 event, I was fortunate to be invited to visit the demo of the FRORE system, a new heat dissipation module that has been put into mass production, which can achieve the heat dissipation effect of the fan module with a smaller size, quieter noise and higher efficiency.
Replace the fan blades with vibrating diaphragms
Although the AirJet Mini looks like a chip, it is essentially completely different from semiconductor cooling, it is still a solution that uses air to actively dissipate heat, and inside it, it has a set of tiny diaphragms that vibrate at ultrasonic frequencies. These tiny diaphragms create a strong airflow that enters the AirJet through the air intakes at the top.
Inside the Airjet, the airflow is converted into high-speed pulsating jets that efficiently remove heat from the heatsink at the bottom of the Airjet. When the flowing air reaches the same temperature as the heatsink in contact with the processor, the hot air is exhausted through the integrated spouts on the sides.
More precisely, AirJet Mini is a crossover product that integrates structural mechanics, fluids, acoustics, and electrical resonance design, according to FRORE System, AirJet Mini draws on expertise in semiconductors, flat panel displays, aerospace, automotive and other fields in the design and manufacturing process.
In the field, the FRORE system also did not forget to compare with conventional radiators. For example, under the premise that it can also generate 1750 Pascals back pressure, AirJet Mini can achieve a maximum power consumption of 1W and a noise of 21 dBA, with a thickness of only 28mm。In contrast, a large exhaust fan capable of producing 1750 pascals is not only impossible to cram, but also requires 60W of power consumption and 69 dba of noise.
The miniaturized design makes it easier for the AirJet Mini to be installed in the notebook, taking the 11mm thick 13-inch notebook as an example, due to the heat dissipation limitation, the processor TDP may be controlled within 10W, and the same cooling module space can fit 3 sets of AirJet Mini, and support the performance release of the processor 20W TDP, while also being able to control the noise within 27DBA.
In other words, without modifying the processor process and overhauling the notebook mold, it can increase its performance by a factor of 2, which sounds pretty impressive just by that.
In fact, there are already mass-produced products that have started using the AirJet Mini. In the demo room, we saw a ZBOX Pico PI430AJ with AirJet Mini PC from ZOTAC, which is a product equipped with a Core i3-N300 processor, LPDDR5 memory, covered with a large area of copper plate above the processor, and matched with 2 AirJet Mini to achieve heat dissipation.
At the same time, it can also be seen that the airjet mini has also added a filter in the operation itself, which can effectively avoid ash when inhaling cold airA space of about 4mm for effective heat dissipation.
At the same time, it should be noted that ZBOX PICO PI430AJ with AirJet Mini PC is one of the few mass-produced products on sale that uses AirJet Mini, and it seems that more effective solutions need to be found in the matching of heat dissipation modules, so so far ZOTAC has only used Core i3 to test the water, and with the deepening of subsequent research and development, more interesting products may be seen.
Full adaptation from PC to industry
As mentioned in the previous chapters, the cooling performance of the AirJet Mini is 10 times better than that of traditional cooling modules, and it is possible to fit 2 or more AirJet Mini at a time in the current thin and light laptop space, which also gives the FRORE System more ideas.
Among them, FRORE System has designed a set of active cooling module solutions for the most popular smartphones and handhelds. Especially for gaming phones that are positioned in e-sports, active cooling mode has been considered in the past two years, so the AirJet Mini and AirJet Mini Slim are undoubtedly one of the good cooling solutions.
The other is the aforementioned thin and light heat dissipation solution. Using the Samsung Galaxy Book 2 Pro 13 as an example, the same cooling module can be replaced with 3 sets of AirJet Mini, which can increase CPU performance by 30%, reduce the heat dissipation area by 33%, and also make the laptop's heat dissipation module have a better dustproof design.
Interestingly, the AirJet Mini works well even in the data center, with a live demo showing an 8TB Cruicial T700 PCIe 50 enterprise-class SSD as a demonstration, under long-term load, the performance can already maintain the sequential read and write speeds of 45000MB s and 42000MB s. AirJet Mini can help enterprise-class SSDs take up less server space.
There are many similar cases, including cooling Macbooks, portable SSDs, and even sticking them to LEDs or industrial equipment to help them get better cooling results in a smaller space.
At present, FRORE System is also actively contacting manufacturers to apply AirJet Mini cooling solutions to more products. If you can achieve more efficient heat dissipation performance with a smaller cooling module and better dust protection, the AirJet Mini's cooling solution will undoubtedly occupy more advantages in future mobile products.
At the end of the article, let's take a look at the FRORE System AirJet Mini in action.