With a history of 57 years, the International Consumer Electronics Show (CES) is the world's largest and most influential annual exhibition of consumer electronics technology. As the "wind vane" of the consumer electronics industry, CES will start in 2024 and bring a grand scientific and technological feast to the industry.
*From: CES
The 2024 CES platform is in full swing. CES encompasses the entire ecosystem of the tech industry, and no other event in the world can match it"Gary Shapiro, president and CEO of the Consumer Technology Association (CTA), said.
Exhibitors showcased a wide range of electronic products, including smartphones, TVs, smart home devices, automotive technology, virtual and augmented reality, artificial intelligence applications, health and medical technology, drones, electronic entertainment devices and more.
CES also often serves as a platform for new product launches and technology trends**, often attracting thousands of businesses and thousands of attendees, including journalists, industry professionals, investors and consumers.
On the first day of CES, we were accompanied by the audience: Let's explore what technology will look like in the future. The cry sounded; Intel Announces Will: Open Automotive Chiplet Platform Brings AI PC Experience to the Car.
Intel has announced plans to bring the company's "AI Everywhere" strategy to the automotive market:
*From: CES
The new AI-enhanced SDV SoC family addresses the industry's critical need for power and performance scalability.
The SoC family features AI acceleration from Intel's AI PC roadmap to enable the most desirable in-vehicle AI use cases, such as driver and passenger monitoring.
The demo showcased 12 advanced workloads, including generative AI, e-mirrors, HD** conference calls, and PC gaming, running simultaneously on multiple operating systems, including a mix of key use cases.
Intel also announced its intent to work with the R&D center IMEC to ensure that Intel's advanced chiplet packaging technology meets the stringent quality and reliability requirements required for automotive use cases.
The move underscores the commitment to be the first automotive vendor to support the integration of third-party chiplets into its automotive products.
This gives OEMs the freedom to choose to integrate custom chiplets into Intel's roadmap products at a fraction of the cost of a fully custom chip; The ability to mix and match chiplets further eliminates the risk of vendor lock-in and promotes a more scalable software-defined architecture.
At the same time, at Intel's booth, Michelle Johnston Holthaus, executive vice president and general manager of the Client Computing Group, said that the company's core chiplet technology products, Arrow Lake processors and Lunar Lake processors, will be available in the second half of 2024.
Holthaus showed off the Lunar Lake chip to the outside world.
As you can see in the image above, Lunar Lake is powered by the Intel Core Ultra architecture with a large chip, which can be made up of multiple chiplets, and two accompanying structures that appear to be dram on the package, similar to the Meteor Lake CPU with LPDDR5X that Intel demonstrated earlier.
Arrow Lake, on the other hand, is an extension of Intel's Core Ultra architecture to high-performance gaming desktops. Compared with previous generations of single-process single-wafer manufacturing, Intel Core Ultra not only achieves heterogeneous integration in the core architecture, but also adopts the method of multi-source wafer manufacturing for the first time.
While Intel's latest Core Ultra processor isn't the first to feature a chiplet design; However, the application landing this time marks that the PC processor has officially entered a new era.
*From: CES
It is understood that Intel will launch the second-generation Core Ultra processor Arrow Lake at the end of this year, including desktop and mobile platforms, using Intel 20A process, the new Lion Cove P-Core and Skymont E-Core, IPC performance will be significantly improved, especially in the game performance has been optimized.
Arrow Lake has up to 8 P-Cores and 16 E-Cores, half a generation of Alchemist Xe-LPG+ graphics cores, and NPU 40 Neural Processing Unit (NPU), AI computing performance increased by 3 times, and it is known as the first gaming CPU with AI accelerator.
Lunar Lake also uses the Intel 20A process, the new Lion Cove P-Core and Skymont E-Core, with a 4P + 4E configuration, and the biggest selling point is to upgrade the new generation of Battle Mage Xe2-LPG graphics core, which can be equipped with up to 8 Xe-Cores, GPU performance will be greatly improved, and the next generation of VCC H. will be supported266 image decoding capabilities.
Perhaps it was a combination of internal and external pressures that forced Intel to embark on a strategic transformation, forcing former SoC leaders to propose a "five-process node in four years" plan to move toward a chiplet model
*Source: Intel
"Five Process Nodes in Four Years" plan: Regain process leadership by 2025 by advancing the five process nodes of Intel 7, Intel 4, Intel 3, Intel 20A and Intel 18A within four years.
Internal pressures such as Intel, one of the world's largest semiconductor companies, have greatly slowed down its iteration speed due to obstacles such as the physical limit of lithography machines and dielectric layer problems after chip manufacturing has advanced to 10 nanometers.
External pressures such as TSMC and other leading factories focusing on wafer manufacturing continue to make breakthroughs in the 7nm and 5nm nodes.
But as of today, we can see that with the smooth promotion of the plan, the Core Ultra processor may be one of the mainstream processors in the AI PC market in the future.
Michelle Johnston Holthaus, executive vice president and general manager of Intel's Client Computing Group, said, "AI PCs will gradually become mainstream over the next four years, accounting for 80 percent of the PC market share. By working with our hardware and software ecosystem partners, Intel is transforming the next generation of computing experiences. ”
At the same time, the new chiplet design, under the synergistic integration of multiple process advantages, has won valuable time for Intel to return to the process leadership; The chiplet model also indicates that the semiconductor industry will present a high degree of collaboration and symbiosis across manufacturers and borders.
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Finally, in the end, through Sima Guang's words in "Zizhi Tongjian: Tang Ji":
The love of mortals, the poor think about change.
May every semiconductor practitioner be able to——
Always responding, always changing!