The CoB (Chip-On-Board) process is a technology that packages chips directly on a substrate, which has the advantages of high packaging density and good heat dissipation performance. Here's a general COB process:
Substrate preparation: Select the appropriate substrate material, and clean and surface treat it to ensure reliable attachment of the chip.
Die Bonding: A chip is placed in a predetermined position on the substrate and fixed to the substrate using an adhesive.
Wire connection: Using wire materials such as gold wire or copper wire, the electrodes of the chip are connected to the pins on the substrate.
Encapsulation material coating: A layer of encapsulation material is applied around the connection points between the chip and the wire to protect the chip and wire and provide mechanical support.
Curing and baking: The encapsulation material is cured and baked to harden and form a stable structure.
Soldering: Using soldering technology, the pins on the substrate are connected to external circuits to ensure the transmission of signals and power.
Testing and quality checks: Functional testing and quality checks are carried out on COB-packaged chips to ensure that they meet the specified standards and requirements.
Final packaging: As needed, the COB packaged chip is further finally packaged, such as mounting the housing, marking the chip model, etc.
It is important to note that the COB process can be adapted and optimized according to specific needs and chip types, and the above process is only a basic step in general.