Plasma cleaning technology has a variety of specific applications in the manufacture and repair of flexible printed circuit boards (FPC), and here are some of the main application examples:
Adhesive removal: In the production process of FPC, various colloids are often used, such as epoxy resin glue, acrylic glue, etc. These fluids may form adhesive residues after curing, affecting the appearance and performance of FPCs. Plasma cleaning technology can effectively remove these adhesive residues and improve the cleanliness and quality of FPC.
Surface Activation: Before lamination of FPC, the inner surface needs to be treated to improve its adhesion. Traditional treatment methods may include the use of chemicals or mechanical grinding, but these methods can cause environmental contamination or damage to FPCs. Plasma cleaning technology can activate the surface of FPC, increase the reactivity of its surface, make it easier to chemically bond with the material in the subsequent process, and improve adhesion and reliability.
Carbide Removal: During the laser cutting process of FPC, black carbides may be created at the edges. These carbides can cause micro-short circuits in high-voltage tests, affecting the performance of FPCs. Plasma cleaning technology can remove these carbides, ensuring the electrical performance and long-term reliability of FPC.
Hole wall cleaning and treatment: In the manufacturing process of FPC, it is often necessary to punch holes and metallize them to form conductive pathways. However, problems such as hole wall contamination and carbide can occur during the punching process. Plasma cleaning technology can clean and treat the hole wall to remove contaminants and carbides, ensuring the quality and reliability of hole plating.
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