First of all, the technology of silicon photonics is applied under pluggable modules, CPO optical engines, and optical IO, which need to be discussed separately.
Effect of silicon photonics on passive devices].
1) Under the silicon photonics module solution, about 30-40% of the passive components will be integrated.
However, some core devices such as fiber arrays will still be available, so the impact on TF and other manufacturers may be limited.
2) The value of passive components may be increased under the CPO and Optical IO schemes.
Thanks to the improvement of integration, the silicon photonics engine solution basically starts with 16 channels, and the subsequent 32 and 64 channels can be realized.
For example, fiber array (FAU), collimating lens array (lens array), and high core count MPO MTP fiber connector (for CPO switch) are positively correlated with the number of channels, and the connection distance is long, such as from the optical engine to the switch port.
The coupling accuracy of the array products used in the silicon photonics solution is higher (the waveguide size of the silicon photonics itself is very small, and the coupling into the optical fiber is easy to over-diverge), and the same number of channels is higher than that of the traditional module solution.
Beneficiary target: Tianfu Communication (full coverage of passive products, deep binding with NV), Taichenguang (MPO connector for CPO switches).
You can pay attention to: Shijia Photonics (silicon-based AWG previously shipped to Intel), Focuslight Technology (the acquired SMO has a layout of collimating lens arrays), Optical Library Technology (its subsidiary Jiahua Weijie has a fiber array), Tengjing Technology (has a collimating lens).
CW light source benefit logic].
1) Volume and price: 70MW light source 1 support 2, that is, 400g silicon photonics (4 channels) with 2, 800g silicon photonics (8 channels) with 4, 100MW light source 1 support 4, but not mature.
2) Penetration rate: 400G DR4 has large-scale commercial use, 800G DR8 is currently actively promoted by Google, and NV focuses on VCSEL solutions (cheaper than silicon photonics) in the 800G generation, with a more cautious attitude.
1.After 6T, the withdrawal of the VCSEL solution will further accelerate the penetration of silicon photonics.
The unit price of CW light source is high in the early stage, 7-8 US dollars for 70MW and 10-15 US dollars for 100MW after mass production.
3) Cutting progress: product barriers are relatively low, from R & D to verification progress, the gap between domestic and overseas is small, Yuanjie is in the first echelon, small batch trial has been shipped, and the opportunity to cut in is high, mainly due to the leading research and development, and the technical advantages of overseas factories are not obvious.
Beneficiary target: Yuanjie Technology (the first echelon of CW light source progress for silicon photonics), Shijia Photonics (layout CW light source); You can pay attention to Changguang Huaxin (INP laser for layout communication).
Silicon photonic packaging and testing equipment logic].
At present, the leading module manufacturers have the ability to make their own silicon photonic packaging and testing equipment, but most of the self-made equipment is semi-automatic and requires manual assistance.
At present, FICONTEC's equipment is fully automated, with high production efficiency, and is more favored by overseas manufacturers.
As of January 24, the company's orders in hand from Nvidia, TSMC and Broadcom were 1007W euros 209W euros 103W euros.
Therefore, from the perspective of industry logic, FICONTEC may benefit more from the industrial trend of CPO and Optical IO.
Beneficiary: Robotec (proposed acquisition of Ficontec).
It is necessary to pay attention to the blue ocean market of optical IO].
Optical IO refers to the solution to the advantages of CPU, GPU, HBM and other inter-chip interconnection, low power consumption, high bandwidth, and low latency, replacing the traditional electrical IO solution with optical interconnection, at present, the first commercial scenario or in the GPU interconnection, GPU and optical engine are sealed on the substrate, from the conceptual product to see the ratio relationship between 1:2 to 1:16, for silicon photonics passive devices, CW light source and silicon photonics packaging and testing equipment is a new incremental market space.
Minutes**: Wen Bagu Research] Mini Program