The low-speed non-destructive laser dicing machine has several advantages and is an important equipment in the photovoltaic and semiconductor industries.
Low-speed non-destructive laser dicing machine is an advanced cutting equipment, which combines the characteristics of high productivity, high stability and high yield, and can achieve non-destructive cutting of ultra-thin cells and different types of cells (such as TOPCON, IBC, HJT, etc.). The low-speed laser non-destructive dicing machine CTC-20S independently developed and produced by Zhongbu Qingtian has the following characteristics:
High-performance laser source: Imported fiber laser is used to provide better beam quality, finer slit and flatter and smoother edges.
Strong compatibility: It is compatible with various types of cells, including single-sided and bifacial PERC cells, N-type TOP-CON batteries, N-type HJT batteries, etc.
High-efficiency production: The equipment has a high production capacity, with a single-sided production capacity of up to 3600p h (whole piece) and a double-sided production capacity of up to 7200p h (whole piece), and can quickly and flexibly switch between the mode of division 2 to 6.
Precise cutting: excellent cutting effect, slotted length 3mm, adjustable depth, high positioning accuracy, 005mm。
Automatic function: equipped with incoming material detection and NG automatic rejection function, optional finished product detection and NG automatic rejection, as well as cell turning over PL detection function, can be directly connected with the stringer.
Low fragmentation rate: The fragmentation rate is controlled at 0 while ensuring the cutting qualityWithin 1%.
The CTC-20S can be used in the following scenarios:
Solar panel manufacturing: In the production process of solar panels, large areas of silicon wafers need to be cut into small pieces for assembly into panels. Low-speed non-destructive laser dicing machines enable this step to be performed precisely and efficiently while minimizing material loss and the generation of microcracks.
Semiconductor wafer dicing: Wafer dicing (also known as dicing) in semiconductor manufacturing is the final stage of the wafer fabrication process. Laser dicing machines are used in this step to cut out individual chips, requiring high precision and low damage to ensure the quality and reliability of the chips.
Solar cell sorting: At the end of the solar cell production, the cells need to be performed performance sorting to ensure that each unit assembled into a module (module) meets the quality standards. Laser dicing machines can be used to remove excess parts from the cell or to perform the necessary scoring for subsequent testing and sorting.
Thin-film solar module production: In the manufacturing process of thin-film solar modules, laser dicing machines can be used to cut thin film materials so that they can be easily applied to different products and designs.
Solar Edge Decoration: Laser dicing machines can also be used to provide decorative or functional cuts to the edges of solar modules to improve the appearance or enhance the overall performance of the module.
For special applications, such as laboratory research, new material development, etc., low-speed non-destructive laser dicing machines may also be used to make samples of specific shapes or sizes.