Nvidia Hundreds of Millions of Dollars in Advance Payments Locking in HBM Production Capacity Concern Event: HBM: Nvidia has paid hundreds of millions of dollars in advances to SK hynix and Micron in order to ensure the stability of HBM, which is equivalent to a confirmed** contract. On December 25, according to foreign media Barron's, when Micron announced its financial report last week, Micron CEO Sanjay Mehrotra revealed that thanks to the popularity of generative AI, the strong demand for high-bandwidth memory (HBM) for high-performance AI chips in the cloud has been promoted, and Micron's HBM production capacity in 2024 is expected to be sold out.
HBM Storage Related**: Concept Stock Carding Series).
Encapsulation Material] - Epoxy molding material: Huahai Chengke, Kaihua material.
Silica powder: Novoray New Materials.
Spherical alumina: One Stone Pass.
Box Bonding Material: Deppon Technology.
Epoxy resin: Hongchang Electronics, Shandong Huapeng, Shengquan Group, Dongcai Technology.
Encapsulation Substrate]-ABF Film: Zhongjing Electronics, Huazheng New Materials.
ABF carrier board: Xingsen Technology, Shennan Circuit.
Process Technology]-TSV: Jingfang Technology, Huatian Technology, Dagang Co., Ltd.
T**: Voge Optoelectronics.
Manufacturing] - Hynix: Taiji Industry, Jacques Technology.
Equipment] Saiteng shares, Yawei shares, Xinqi micro installation.
Distributors] Shannon Xinchuang, Yachuang Electronics.