Chip encapsulation is the process of encapsulating a chip inside an external protective enclosure and typically includes the following steps:
Preparation: including the preparation of packaging materials (encapsulant, packaging cover, etc.), prepared chips, pins, substrates, etc.
Bonding: The chip is bonded to the package substrate. Thermally conductive adhesives or other adhesives are often used to secure the chips to the substrate.
Wire bonding: The chip pins are soldered to the connection points on the substrate with gold wires or aluminum wires. This step is often referred to as bonding.
Encapsulant Injection: Encapsulant is injected between the packaging substrate and the chip to protect the chip and increase the strength of the package.
Curing: The encapsulant is cured to harden and secure the chip and pins.
Cover mounting: The cover is mounted on the substrate to protect the chip and encapsulant.
Testing: The packaged chip is tested to ensure that it is functioning properly.
Cleaning and packaging: The packaged chip is cleaned and then packaged for storage and transportation.
These steps are usually the basic steps in the chip packaging process, and there may be some extra steps or details for different types of packaging.