Netizens questioned when the mobile phone will be closed?Huawei responds to the rescue of the micropump liquid-cooled shell
Some time ago, the hottest mobile phone was not Apple's iPhone15, but Huawei's Mate60 series, with sales exceeding 1 million units in just a few days, and its sales volume will exceed 20 million units, setting a sales record for Huawei's Mate series.
Mobile phones are so fashionable, and peripherals are also very popular. In addition to third parties, Huawei itself has also launched many official mobile phone cases, films and other products for the Mate60, which are well received by consumers.
Compared with the common styles of peripherals, this time the Mate60 series has an exclusive phone case called"Micropump liquid-cooled phone case"。
What are the special features of this phone case?As you can see from the name, this shell focuses on heat dissipation and adopts"Micropump liquid cooling technology"A micropump is used to circulate the liquid to the heat sink on the back of the phone, and the heat generated by the phone is taken away through heat transfer.
Don't underestimate this shell, it is a black technology, it does not need an external power supply, and automatically adjusts the flow and pressure according to the change of the temperature of the mobile phone, with a real intelligent temperature control effect.
The question is: why did the Mate60 launch such a unique heatsink phone case?Some digital bloggers said that although the Kirin 9000S chip is very strong, because the process and architecture are relatively not so advanced, the heat generation will be relatively higher, so this"Liquid-cooled micro-pumps"can come in handy.
In fact, in recent years, other mobile phones have been like this, the performance of the chip is getting stronger and stronger, but at the same time, it has also brought an increasingly serious problem, that is, the mobile phone is getting hotter and hotter the more you use it.
In order to solve the problem of mobile phone heating, manufacturers are also heartbroken, everyone shows their powers, on the one hand, it is to increase the area of the heat sink, as well as various new materials, what graphene, liquid metal and temples, in addition to the introduction of various new technologies, such as Huawei's"Liquid cooling technology", Xiaomi's"Annular cold pump cooling system""...
Consumers, the heat dissipation method is even more strange, and even the clip of the cooling fan on the back, which seriously affects the feel and experience, has been made in, and I have to say that the mobile phone is really worrying about hot hands.
According to the principle, the main culprit of the heating of the mobile phone is the chip, because the processor will generate heat when it runs at high speed, and the heat generated will be conducted to the human body, and when it is higher than the human body temperature, the person will obviously feel the heat.
According to the most basic law of conservation of energy, the stronger the performance of the chip, the more heat will be generated, and it is impossible for any chip to increase its performance and reduce its energy consumption at the same time, because this is anti-science.
Over the years, the manufacturing process of mobile phone chips has gone from 10nm to 7nm and then to 5nm, and now Apple's A17Pro chip is already 3nm visible to the naked eye.
As the process progresses, the performance improves, the score gets higher and higher, but the energy consumption also gets higher and higher, and the temperature naturally gets higher and higher.
On the other hand, the heating of mobile phones also has a lot to do with the ARM architecture.
We know that most of the mobile phone chips with ARM architecture in the past were two clusters, that is, the 4+4 8-core architecture, which has 4 large cores and 4 small cores, taking into account both performance and power consumption.
Later, ARM found that the 4+4 one-two-cluster design, the performance was still not enough, so it came up with a super-large core, and then later Qualcomm, MediaTek and other manufacturers, and then there was a 1+3+4-three-cluster chip design, with 1 super-large core + 3 large cores + 4 small cores in one chip. Especially after the launch of the armv9 architecture, it is basically this three-cluster design, all for advanced performance.
In the middle, the super core is full of firepower and is responsible for the operation, and then there are 3 big cores to work together, and then the heat is further diluted.
It is especially typical that in 2022, Qualcomm Snapdragon 8Gen1 chip, Apple A15 chip, Samsung Exynos2100 and other chips will collectively heat up, while Samsung and TSMC have said that there is no problem with their own process, mainly because there is a problem with the ARM design, which has poured the pot for ARM.
In fact, in addition to the three-cluster design, now mobile phone chip manufacturers are desperately increasing the working frequency in order to improve performance, such as Apple's A17Pro chip, the working frequency is as high as 38GHz, which is no longer inferior to the frequency of desktop CPUs.
The Kirin 9000S chip on Huawei Mate60 uses ARMV8 architecture, 1+3+4 triple cluster design, 1 262GHz super large core + 3 pcs 215GHz large core + 4 pcs 1The 53GHz small core is also a super large core to improve performance.
At present, ARM chips use a triple-core design, and the chip process itself is also related to high frequency, which is no stranger to heating.
The mobile phone has a small space and can only passively dissipate heat, and there is not even a fan, so it naturally can't hold down the temperature, so we will feel hot when we use it.
Of course, the heating of the mobile phone is also related to the system and APP. The current mobile phone system has many functions and large size, of course, the performance is very delicious when running, and the current APP is the same, with a volume of a few GB at every turn, and various special effects, so that the chip always maintains high-speed operation, and of course it will also generate a lot of heat.
These reasons are interlinked, and together they have caused the phenomenon of mobile phones getting hotter and hotter these days.
Seriously, all kinds of mobile phone heat dissipation black technology, large-area heat dissipation plates, various liquid cooling and heat dissipation technologies, mobile phone heat dissipation shells, etc., are all palliative, not root causes, belong"Headache heals, foot pain heals"type. As long as the chip continues to develop according to the current development trend, heat dissipation cannot keep up with the development of the chip.
In the author's opinion, to solve the problem of mobile phone heating, the key is to start with the chip, the system, and the ecology, which is the root of the problem.
Especially on the chip, we can't blindly chase performance, we must seek a balance between performance and power consumption, adjust the design of this supercore + core + external core under the current ARM architecture, not to mention the performance improvement brought by the magic change frequency, especially the magic change to increase the frequency, there is a great suspicion of putting the cart before the horse, which will lead to more serious heating.
If possible, directly abandon the current ARM architecture, choose other more advantageous architectures, or completely solve the problem of ARM chip heating.
Especially in China, ARM has been Huawei, Feiteng and other manufacturers, cut off the latest ARMV9 architecture, we are still stuck in the ARMV8 architecture, compared with the latest V9 architecture, old, difficult to iterate, the disadvantages are more obvious.
Based on the ARMv8 architecture, the performance is relatively poor, but ARM's latest IP cores cannot be used, so in order to create a stronger chip on the basis of ARMv8, great changes must be made, such as increasing the working frequency of the CPU, such as the magic change of the CPU core, etc.
These changes will eventually lead to more serious chip heating, so domestic manufacturers using ARM architecture, especially chip manufacturers, have cut off the supply, to solve the problem of chip heating, the difficulties will be greater, perhaps give up the ARM architecture, choose a more suitable chip architecture, it is not a good way.
Of course, in addition to optimizing the chip, it is also necessary to arrange the system reasonably to reduce the burden on the CPU.
In addition, it is necessary to strictly control the APP, govern the ecology, and severely crack down on the behavior of large volume, bloated functions, slow operation, and even continuous launch and reading of APP user information in the background.
Through these means, it is believed that the phenomenon of hot sales of mobile phones will be greatly improved.