On February 23, Changdian Technology announced that its holding company, Changdian Technology Automotive Electronics (Shanghai)**, was approved by shareholders such as National Integrated Circuit Industry Investment (Phase II) and Shanghai State-owned Asset Management Shanghai Integrated Circuit Industry Investment (Phase II) to increase capital by RMB 4.4 billion after the first phase of capital increase came into effect$5.1 billion was in place on February 22; The rest of the capital increase will be in place in three phases according to the agreement, fully supporting JCET to accelerate the construction of the company's first advanced packaging base for large-scale production of finished automotive-grade chips in Lingang, Shanghai, to serve customers and industry partners in the field of automotive electronics at home and abroad.
As a professional automotive chip packaging and testing factory, the project will be equipped with a highly automated dedicated production line for automotive chips, establish a complete automotive-grade business process, comprehensively build a lighthouse factory for intelligent manufacturing and lean manufacturing of automotive-grade chips, and provide customers with robust production process control and complete quality inspection processes with the goal of zero defects, exceeding the stringent requirements of automotive-grade chip manufacturing.
After the completion of the project, it will flexibly adapt to the diverse needs and standards of customers, and the future products plan to cover automotive ADAS sensors, high-performance computing, interconnection, electric drive and other automotive application fields, provide end-to-end complete packaging and testing services for the automotive industry chain, form a complete chip finished product chain, and drive the entire industry chain to develop in the direction of high performance, high reliability and high automation.