PCBA chip processing and manufacturing involves a series of processes such as PCB board manufacturing, PCBA incoming component procurement and inspection, SMT chip processing, DIP post-welding processing, post-welding processing, program burning, PCBA testing, aging, etc., the first chain and manufacturing chain are long, and any mistake in any link will lead to a high probability of PCBA finished products, therefore, quality management in PCBA processing is particularly important.
The following are the precautions for several aspects of Sichuan Interli analysis:
1.PCB circuit board fabrication.
After receiving the order for PCBA processing, it is particularly important to hold a meeting before production, the main reason is that the process analysis of PCB drawing files can be carried out in advance during the meeting, and DFM (manufacturability report) can be submitted according to the needs of different customers, but many small manufacturers do not pay attention to this, which will lead to quality problems caused by poor PCB design, and a lot of rework and repair work will be generated in the future.
2.PCBA incoming component procurement and inspection.
The company's procurement must strictly control the procurement channels of components, and should be purchased from large first-class merchants or original factories, so as to avoid buying second-hand materials and counterfeit materials
l PCB: Check the temperature test of the reflow oven, whether the vias without flying wires are blocked or leaking, and whether the board surface is bent.
l IC: Check whether the screen printing is consistent with the BOM, and store it at a constant temperature.
l Other commonly used materials: check screen printing, appearance, power-on measurement, etc.
3.SMT chip processing.
Solder paste printing and reflow temperature control are key points in SMT assembly, and higher quality laser stencils should be used that meet the processing requirements. And according to the requirements of the PCB board, increase or decrease the stencil hole or U-shaped hole as needed. The temperature control of the reflow oven is essential for the wetting of the solder paste and the firmness of the PCBA, and this step can be adjusted according to the SOP operation guide.
4.Plug-in processing.
In this process, the design of the over-wave soldering mold is the key, and the use of the mold carrier to improve the yield rate is what engineers need to continue to learn.
5.PCBA board test.
For orders with PCBA test requirements (main test contents: ICT [circuit test], FCT [functional test], aging test, temperature and humidity test, drop test, etc.).
The above is a brief description of the key points of quality control of PCBA customized processing by Sichuan Interli, Sichuan Interli mainly does SMT patch processing, DIP plug-in processing, post-welding processing, testing and other one-stop services, if you need to come to our company to discuss cooperation.