CAPCON, the world's leading semiconductor hardware and software solutions** provider, will participate in SEMICON China 2024, which will be held from March 20 to 22, 2024 at the Shanghai New International Expo Center.
We invite you to visit CAPCON locatedHall T1, Booth T1439The booth that brought the latest series of products was the Andromeda series **Antgo A2 real machine display. You will also have the opportunity to interact with our team of experts at home and abroad**.
Capcon Limited is a high-end equipment manufacturer focusing on the field of advanced packaging equipment. We are committed to providing customers with advanced semiconductor packaging products, technologies and solutions. At present, it has branches in Singapore, Taiwan, the Philippines, Beijing and other places.
The group company has the world's leading founding team and product technology in the field of advanced packaging equipment, and its mature equipment product line has been recognized by internationally renowned semiconductor packaging and testing manufacturers. The customers served include TSMC, ASE Group, Silicon Products, Electric Technology, Tongfu Microelectronics, Deetee, etc. The Group's products have achieved comprehensive coverage of advanced packaging and placement processes, including FOWLP (Face Up Down), POP, MCM, EMCP, STACK DIE, SIP, and 25D 3D, FCCSP, FCBGA, etc.
The group company is positioned in the field of semiconductor advanced packaging, and provides a new generation of semiconductor assembly and packaging equipment for semiconductor back-end processes, such as flip-chip bonder, chip-on-wafer bonder, POP package-on-package bonder, stack die bonder, panel-level bonder. panel-level die bonder), multi-chip die bonder, etc.