Samsung recently announced an ambitious plan to invest about 40 billion yen (about 19.) in Japan over the next five years9.2 billion yuan), a move aimed at establishing a new advanced chip R&D center in Yokohama, Kanagawa Prefecture.
At the heart of this strategy is the establishment of a research facility focused on high-end chip packaging technologies. This decision is not sudden, as early as March this year, Samsung has publicly expressed its intention to set up a chip packaging factory in Kanagawa Prefecture, in order to strengthen cooperation with local chip equipment and material manufacturers in Japan. The company already has R&D facilities in the region, and this additional investment is clearly aimed at deepening ties with the Japanese tech industry. Japan** also plans to provide up to 20 billion yen (about 9.).9.6 billion yuan) to help revive the domestic chip R&D and production ecosystem.
It is understood that this move occurs in the context of increasingly fierce competition in the global chip industry, especially the technological battle between China, the United States and Japan. Samsung, the world's second-largest semiconductor manufacturer, has been working to improve chip packaging technology, a technology that integrates multiple components on a single chip to achieve smaller size and higher energy efficiency. The purpose of this strategy is to gain a competitive advantage in key technological aspects.
While Samsung's share of the foundry market is currently less than that of its main rival TSMC, the company plans to invest up to $230 billion in the coming years in an effort to overtake TSMC as the world's largest chipmaker. This investment plan will undoubtedly have a profound impact on the global semiconductor industry.