Introduction: The battle for chip technology supremacy has begun to move to a new realm:How to package chips more efficiently for better performance
Whether in terms of technology or capital, it is becoming more and more difficult to make semiconductor chips smaller, and the difficulty and cost of continuing to make small chips have increased greatly.
The battle for chip technology supremacy has begun to move to a new fieldHow to package chips more efficiently for better performance
The rise of artificial intelligence will further drive the demand for advanced packaging technologiesAnd create new track opportunities for later challengersIn order to make up for the shortcomings in other links of the chip chain.
Since Moore predicted that the number of transistors that could fit on an integrated circuit would double roughly every two years, chip manufacturing technology has advanced by leaps and bounds.
One solution to this problem is:No longer the quest to manufacture every part of the chip with state-of-the-art processes
Chipmakers can find new ways to package different types of components together in a more efficient wayDoing so will improve performance while reducing costs
TSMC is already a global leader in manufacturing advanced logic chipsBut at the same time, there is also a huge investment in the development of packaging technology
TSMC plans to double the production capacity of its advanced packaging technology, COFOS (chip on wafer on substrate), in 2024.
This technology stacks logic chips and memory chips on top of each other to increase the speed of data transfer between them
In addition to the lack of production capacity of AI chips themselves, the lack of advanced packaging capacity has also become an important factor hindering the demand for AI chips.
TSMC has cutting-edge cowos technology and is well positioned to capitalize on this development.
Manufacturers of packaging process equipment, such as Disco Corporation, which produces wafer grinding machines, are also expected to benefit.
More traditional chip assembly and test companies aren't necessarily far behind, and may not be as technically as good as companies like TSMC, but they're investing heavily in trying to catch up.
In the field of packaging, China may also be able to make more rapid progressChina has taken the largest share of the global chip assembly and test market
The world's leading packaging company has set up factories in China, and JCET is the world's third-largest chip assembly and testing company, after Taiwan's ASE Semiconductor.
The packaging technology is not currently subject to U.S. sanctionsGiven the deteriorating relations between China and the United States, this is likely to change, and few companies are completely immune.
Although China's market share in this area is already so high, any action the United States takes will face complications.
At a time when the "arms race" around chips is already heating up,The rise of AI is pushing this competition to infiltrate every corner of the chip chain
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